Dow Electronic Materials are proud to be exhibiting at the upcoming Productronica 2015 conference in Munich this year on November 10-13th
There have been many new developments at Dow Electronic Materials since the last Productronica conference in 2013. Since then, we announced the first commercial installation of our LITHOJET™ inkjet printable resist technology in a double sided printed circuit board application. LITHOJET™ technology for printed circuit boards is capable of use as both a plating resist and an etch resist.

We have also developed a new CIRCUPOSIT™-brand horizontal electroless copper plating process making use of an ionic Pd catalyst and an EDTA-free complexing system. The CIRCUPOSIT™ 6500 electroless copper plating process offers a lower Pd concentration compared to other horizontal ionic catalyst systems resulting in improved costing. It also gives an improved environmental footprint compared to EDTA-based complexing technology.

We would also like to announce that our new product, MICROFILL™ THF-100 electrolytic copper plating bath, has been selected as one of the finalists for the R&D 100 awards for the calendar year 2015. The R&D 100 honors the top one hundred innovations of the year, as selected by R&D Magazine. We are proud to know that this enabling technology is being considered for this prestigious award. Read further about how MICROFILL™ THF-100 electrolytic copper plating bath addresses the changing requirements in high-density PCBs driven by portable consumer electronics.
As you can see, it has been a busy couple of years! We will be available at Productronica 2015 to discuss any chemical process supply needs for building your printed circuit boards. Please stop by Stand #305 in Hall B1 to discuss our recent technology developments, and share your company’s latest material needs.