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A-Gas EM attends Productronica 2015
03 November 2015

Dow exhibiting at Productronica

Dow Electronic Materials are proud to be exhibiting at the upcoming Productronica 2015 conference in Munich this year on November 10-13th
There have been many new developments at Dow Electronic Materials since the last Productronica conference in 2013. Since then, we announced the first commercial installation of our LITHOJET™ inkjet printable resist technology in a double sided printed circuit board application. LITHOJET™ technology for printed circuit boards is capable of use as both a plating resist and an etch resist.

We have also developed a new CIRCUPOSIT™-brand horizontal electroless copper plating process making use of an ionic Pd catalyst and an EDTA-free complexing system. The CIRCUPOSIT™ 6500 electroless copper plating process offers a lower Pd concentration compared to other horizontal ionic catalyst systems resulting in improved costing. It also gives an improved environmental footprint compared to EDTA-based complexing technology.

We would also like to announce that our new product, MICROFILL™ THF-100 electrolytic copper plating bath, has been selected as one of the finalists for the R&D 100 awards for the calendar year 2015. The R&D 100 honors the top one hundred innovations of the year, as selected by R&D Magazine. We are proud to know that this enabling technology is being considered for this prestigious award. Read further about how MICROFILL™ THF-100 electrolytic copper plating bath addresses the changing requirements in high-density PCBs driven by portable consumer electronics.
As you can see, it has been a busy couple of years! We will be available at Productronica 2015 to discuss any chemical process supply needs for building your printed circuit boards. Please stop by Stand #305 in Hall B1 to discuss our recent technology developments, and share your company’s latest material needs.