Dow - SOLDERON? BP TS 6000 Tin-Silver Wins R&D 100 Award
Dow are pleased to announce that on November 13 Dow Electronic Materials received an R&D 100 Award for the development of SOLDERON™ BP TS 6000 Tin-Silver Chemistry. This is the second award they have received this year for their tin-silver chemistry! In April they also received a Bronze award from the Edison Awards. At the R&D 100 Awards, they were once again recognized for developing a lead-free bump plating chemistry that provides their customers with superior performance and cost of ownership.
The R&D 100 Awards are sponsored by R&D Magazine and they are viewed widely as a prestigious honor. This award further validates the accomplishments of the development team to bring this lead-free solder chemistry to the advanced packaging market to provide our customers with a material that helps them succeed.
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