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14 June 2021

HSQ Resist

A-Gas EM is pleased to offer HSQ Resist from the manufacturer EM Resist. SiOx is a high purity, silsesquioxane-based semiconductor grade polymer applicable as a negative tone resist for electron beam patterns, EUV, nanoimprint lithography and Step and Flash Imprint Lithography (SFIL). It is readily soluble in non-polar organic solvents like methyl isobutylketone (MIBK), methyl siloxane and toluene for thin-film fabrication. Depending on the film thickness, a dense pattern with sub-10 nm half-pitch can be achieved. The resist can be supplied in liquid form, powder form or in a self-dilution kit.

The product has the following attributes

• Direct write of thin uniform films
• High resolution (<10 nm)
• Excellent line edge roughness
• Good dry etch resistance
• Available in powder or liquid form
• Customisable solutions
• Very long shelf life in powder form at 20°C
• Very high thermal stability

For more details please email Dave.Shaw@agas.com or use the contact us page


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