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29 July 2016

Microchem Corp release PermiNex™ 1000 and 2000 Series - photoimageable wafer bonding adhesives

MicroChem PermiNex™ 1000 and 2000 resists are epoxy based, photo-imageable bonding resists used as an adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices, and others, where critical alignment, low temperature processing and high bond quality are desired.

Further details can be found on our MCC products page