Ordyl AM 900 is a negative, aqueous process able dry film designed to be exposed both with sources at 405 nm

wavelength, double wavelength systems (when one is 405 nm) and standard UV sources.

AM 900 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to

leaching in all the most commonly used plating bath in PCB manufacturing.

Ordyl AM 900 has good adhesion on copper surface and for this reason is indicated for direct plating process and in

case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling

holes; this can be achieved starting from 40 µm thickness.