Dry Films

  • Ordyl Alpha 800

    Ordyl Alpha 800 is a negative, aqueous universal dry film designed to be used for the most common PCB applications.

    Alpha 800 can be exposed with LDI or with standard UV lamps and is developable and strippable in mildly alkaline

    solutions. It offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB

    manufacturing.

    Ordyl Alpha 800 is particularly recommended for innerlayers thanks to excellent developing properties that leaves the

    copper surface very clean and ready for the black oxide process. This type of dry film ensure good tenting

    performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • Ordyl Alpha 900

    Ordyl Alpha 900 is a negative, aqueous universal dry film designed to be used for the most common PCB applications.

    Alpha 900 can be exposed with LDI or with standard UV lamps and is developable and strippable in mildly alkaline

    solutions. It offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB

    manufacturing.

    Ordyl Alpha 900 guarantee very good adhesion on copper surface. This type of dry film ensure good tenting

    performances even on large tooling holes; this can be achieved starting from 40 µm thickness.

  • Ordyl AM100

    Ordyl AM 100 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also

    with standard UV lamps.

    AM 100 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to

    leaching in all the most commonly used plating bath in PCB manufacturing.

    Ordyl AM 100 has good adhesion on copper surface and for this reason is indicated for direct plating process and in

    case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling

    holes; this can be achieved starting from 40 µm thickness.

  • Ordyl AR2005

    Ordyl AR 200S is a negative, aqueous processable dry film designed to be exposed with UV and LDI exposure machine.

    AR 200S is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to

    leaching in all the most commonly used plating bath in PCB manufacturing.

    Ordyl AR 200S has good adhesion on copper surface and for this reason is indicated for direct plating process.

    This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from

    40 µm thickness.

  • Ordyl Alpha 300

    Ordyl Alpha 300 is a negative, aqueous dry film specifically designed to have extremely high resistance in alkaline

    solutions and galvanic Nickel/Gold. It can be exposed both with LDI and standard UV lamps.

    Alpha 300 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to

    leaching in all the most commonly used plating bath in PCB manufacturing.

    Ordyl Alpha 300 guarantee good adhesion on copper surface. This type of dry film has a good flexibility and ensure

    good tenting performances even on large tooling holes; this can be achieved starting from 40 µm thickness.