Ordyl AM 100DI is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable

also with standard UV lamps.

AM 100DI is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to

leaching in all the most commonly used plating bath in PCB manufacturing.

Ordyl AM 100DI has strong adhesion on copper surface and for this reason is indicated for direct plating process and in

case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling

holes; this can be achieved starting from 40 µm thickness.

Ordyl FLR 1000 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable
also with standard UV lamps.
FLR 1000 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to
leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl FLR 1000 has strong adhesion on copper surface and for this reason is indicated for direct plating process and in
case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling
holes; this can be achieved starting from 40 μm thickness.

Ordyl FLR 4000 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable
also with standard UV lamps.
FLR 4000 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to
leaching in all the most commonly used plating bath in PCB manufacturing.
Ordyl FLR 4000 has good adhesion on copper surface and for this reason is indicated for direct plating process and in
case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling
holes; this can be achieved starting from 40 μm thickness