High Speed

  • Solderon BT-150

    Solderon BT-150 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines and provides fully bright pure tin deposits over a wide range of current density and bath temperature. The low-foaming Solderon BT-150 electrolyte is free of volatile aldehydes and may be operated at temperatures up to 45°C and tin concentrations up to at least 100 g/l without loss of deposit brightness. Convenient methods of analysis are available for the proprietary components.

  • Solderon BT-280

    Solderon BT-280 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. The Solderon BT-280 electrolyte gives bright deposit over a wide range of current density. Its propriety formulation controls both grain size and grain orientation, which results in a stable deposit. The additive system also plates bright Sn finish with minimum organic inclusions. Simple analytical procedures are available for all products in the process.

  • Solderon BHT-350

    Solderon BHT-350 Bright Tin is high speed, sulphonate-based tin electroplating product formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. The Solderon BHT-350 Bright Tin electrolyte is free of volatile aldehydes and may be operated at temperatures up to 50°C.

  • Solderon MHS-W

    Solderon MHS-W is a high speed, non-foaming electroplating process for the rapid deposition of fine grain, matte tin and tin-lead alloy coatings from an organic sulfonate electrolyte. The process is particularly designed for use in wire plating equipment where foaming of the electrolyte is undesirable and can cause severe handling problems. The Solderon MHS-W system is based on a grain refining agent which does not produce a stable foam in the electrolyte, even under extreme agitation conditions. The components of the Solderon MHS-W are stable and soluble in the electrolyte at elevated temperatures which allows the use of higher cathodic current densities of operation. Uniform pure tin and tin-lead alloy deposits, which exhibit excellent solderability and fusing characteristics, are obtainable over a wide current density range.

  • Solderon ST-200

    Solderon ST-200 is a low foaming, organic sulfonate electroplating process for the high and low speed deposition of uniform, large well-polygonized grain tin deposits. Solderon ST-200 is specifically designed for use in high-speed magazine-to-magazine and reel-toreel electroplating equipment, where the process versatility is particularly well suited for semiconductor lead frame and electronic connector applications. The process can also be operated at modified parameters to meet the needs of low speed plating applications.

  • Solderon ST-300

    Solderon ST-300 is a high speed, sulphonate - based tin process formulated for continuous electroplating of lead frames in reel-to-reel and magazine-to-magazine machines. Due to its specific designed chemistry, the Solderon ST-300 electrolyte provides a deposit with a low whisker propensity. The tin deposits are matte to satin-bright in appearance and uniform over a wide range of current density. Simple neutralisation of drag-out rinse water will produce a non-hazardous effluent.

  • Solderon ST-300T

  • Solderon ST-380

    Solderon ST-380 is a high speed, sulphonate-based tin process formulated for continuous electroplating of lead frames in reel-to-reel and magazine-to-magazine machines over a wide current density range. Due to the specific chemistry design, the Solderon ST-380 electrolyte provides a deposit with low whisker propensity and excellent solderability performance especially at 215°C after 8 hours steam aging. Simple neutralization of drag-out rinse water will produce a non-hazardous effluent.