Solderon BHT-90 produces fully bright, solderable, 90/10 tin-lead alloy deposits from a low foaming electrolyte. The process is characterized by its high cathode efficiency and ability to produce fully bright deposits at elevated temperatures over a wide operating range.
Solderon BT-64 is a low foaming electroplating process for the high speed deposition of bright 60/40 tin-lead alloys from a non-fluoroborate electrolyte. The process is distinguished by its low foaming character, minimizing the problem of poor definition caused by stable cathodic foam in controlled depth selective electro-deposition. Solderon BT-64 is designed for use in the high speed reel to reel selective electroplating of connector components. Deposits produced have excellent solderability and pass the Military Specification 202F.
Solderon BTD is a non-foaming electroplating process for high speed deposition of bright to semi-bright tin and tin/lead alloys from a non-fluoborate electrolyte. The process is distinguished by its high cathode efficiency and non-foaming character, which minimizes the problem of poor definition caused by stable cathodic foam in controlled depth cell electro deposition. Solderon BTD is designed for use in high speed reel-to-reel selective electroplating of connector components. The 90/10 tin-lead alloy system offers the most versatility with respect to the influence of cell design on bright tin-lead alloy electro-deposition. Deposits produced from the Solderon BTD process exhibit exceptional solderability performance, and meet or exceed Military Specification 202F.
High Speed Matte Tin/Copper Alloy Electroplating Process Solderon MTC-200 is a low foaming, organic sulfonate electroplating process for the high speed deposition of uniform, fine grain, matte tin/copper alloy coatings. Solderon MTC-200 is specifically designed for use in high speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector application. Characteristics 1. Environmetally friendly, lead-free coating 2. Low foaming electrolyte 3. Uniform deposit appearance 4. Excellent solderability 5. Minimum whisker formation probability.