Ronastrip TL-85 is designed for fast stripping of thin or tin-lead from copper and its alloys. It can be used in both dip and spray applications. Stripping rates of ca. 10 microns/minute can be achieved in still vat conditions, this can be increased to a maximum 50 microns/minute in spray conditions dependent upon agitation rate and temperature. Attack on copper is minimal (ca. 0.05 micron/minute), the copper being left in excellent condition for subsequent processing. The solution will dissolve about 100 g/l total tin and lead before it is exhausted. Ronastrip TL-85 is ideally suited for use on printed circuit boards e.g. edge tab stripping prior to gold plating especially in high speed linear tab plating machines, or metallic etch resist (tin or tin-lead) stripping to produce solder mask over bare copper boards.

Solder Strip SM is a non-peroxide, non-fluoride containing process designed for fast stripping of tin or tin-lead from copper and its alloys. Solder Strip SM is primarily designed for use under spray agitation conditions but it can also be used in dip applications. Stripping rates of approx. 7 microns/minute can be achieved, which can be increased to a maximum 20 microns/minute under vigorous spray conditions dependent upon agitation rate and temperature. Solder Strip SM does not attack copper. Solder Strip SM does not leave any residues or "white smut" nor do tin or lead salts precipitate from aged solutions on standing. The solution will dissolve about 100 g/l total tin and lead before it is exhausted when it should be replaced, although a replenishment system based on a 30% bail-out and replacement with new is feasible. Solder Strip SM is ideally suited for use on printed circuit boards e.g. edge-tab stripping prior to gold plating especially in high speed linear tab-plating machines. It can also be used to strip tin or tin-lead which has been applied as an etch resist in the production of soldermask over bare copper (SMOBC) boards. Solder Strip SM is suitable for use in equipment where the solution is in contact with titanium.