Solderon BLS-2 is a fluoborate free tin-lead electroplating process formulated for rack or barrel applications. The deposits, which are uniform and brilliant, can have an alloy composition in the range 60:40 to 95:5 tin-lead, depending on the respective concentrations of tin and lead in the solution. The additive system meets the requirements of the Directive 2003/53/EC of the European Parliament on the restriction of dangerous substances such as nonylphenol and nonylphenol ethoxylate.

Solderon LG is a fluoroborate-free plating solution designed to deposit matte pure tin or tin-lead coatings onto the terminals of electronic components containing pH sensitive dielectric materials. The Solderon LG solution operates in the pH range 2.5 - 4.5 with minimal attack on glass/ceramic insulators which prevents subsequent deposition of metal onto the dielectric part of the components. Solderon LG can be used to process ceramic-based components such as chip capacitors and diodes or soft leaded-glass components e. g. ceramic dual-in-line packages (cerdips). The electrolyte can be used in either rack or barrel applications to produce deposits which meet the requirements of MIL STD 202 F.