COPPER GLEAM™ ST-920 Acid Copper is specifically formulated for use with copper anodes and direct current (DC) rectification. The product offers excellent through-hole throwing power combined with excellent conformal microvia plating. Formulated to operate over a broad range of operating conditions, the bath offers end users with excellent production flexibility in either panel or pattern plate operation.

ELECTROPOSIT™ 1000 ACID COPPER is designed for reliable through-hole plating of thick multi-layer printed circuit boards with hole aspect ratios up to 15:1 and beyond.

ELECTROPOSIT™ 1300 ACID COPPER is a single-component additive system that combines the functions of brightener and leveler, and is designed for reliable through-hole plating of multi-layer and double-sided printed circuit boards of conventional/medium aspect ratio.