Through Hole Fill

  • Microfill THF

    MICROFILLTM THF Electrolytic Copper is designed to offer outstanding through-hole fill particularly for substrates intended for use as core layers in sequential build-up SBU) applications. The bath is designed for use with insoluble anodes and direct current (DC) rectification. Formulated to operate over a broad range of operating conditions, the bath offers end-users outstanding production flexibility in either panel or pattern plate operating modes.