AUROLECTROLESS™ SMT 520 Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and electroless palladium. The AUROLECTROLESS™ SMT 520 Immersion Gold bath is easy to control and has high tolerance to contaminants. Applied as part of ENIG or ENEPIG processes, the deposits are suitable for a wide variety of soldering and wire bonding applications.

AUROLECTROLESSTM SMT 525G Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and electroless palladium. The AUROLECTROLESS SMT 525G Immersion Gold bath is easy to control and has high tolerance to contaminants. Applied as part of ENIG or ENEPIG processes, the deposits are suitable for a wide variety of soldering and wire bonding applications.

CIRCUPOSIT™ ETCH 3330 is a mildly acidic micro-etch that promotes excellent copper innerlayer adhesion, and creates baths that are stable and active for very long periods of time with consistent etch rates.

DURAPOSITTM SMT 810 is an electroless nickel system specifically formulated for use in combination with AUROLECTROLESS Immersion Gold. DURAPOSIT SMT 810 combined with AUROLECTROLESS SMT 520 Plating has excellent corrosion resistance and solderability, which is maintained at both high and low bath loading and throughout the solution life. The self-adjusting pH feature simplifies bath operation and makes the process ideal for use with Dow Electronic Materials automatic bath control systems.

Duraposit™ SMT 88 is an electroless nickel system specifically formulated for use in combination with Aurolectroless immersion gold baths. Duraposit SMT 88 produces a bright uniform ENIG deposit on properly prepared PWB substrates.

ELECTROPOSIT™ PC CLEANER is an acidic soak cleaner that is used to clean the copper surfaces of printed circuit boards prior to pattern plating, activating the surfaces as it cleans.

PALLAMERSE™ SMT 2000 PALLADIUM PROCESS is an improved process to coat printed circuit boards with palladium for subsequent SMT assembly applications, and is capable of autocatalytic deposition of palladium-phosphorus coatings on either copper or nickel.

RONACLEAN™ PC 960 is an acid cleaner specifically developed to remove oxidation from copper surfaces after photomech and is effective for all fully-aqueous dry-film systems.

RONAMERSE™ SMT CATALYST CF is a catalyst designed for activation of copper printed circuit boards to ensure that complete and uniform coating of Duraposit SMT 88 is produced, while not coating non-conductive area.