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CIRCUBOND™ TREATMENT 2218 is a peroxide-sulfuric-based etch that produces a uniform, highly textured and passivated surface coating on copper innerlayers that provides excellent adhesion promotion in subsequent lamination processes.

CIRCUBOND™ CLEANER 140 is a low-foaming, alkaline-spray cleaner that can be used in both vertical and horizontal processing prior to the CIRCUBOND™ TREATMENT PROCESS.

CIRCUBOND™ PRE-DIP 2217 is a solution designed to provide a surface compatible with the CIRCUBOND™ TREATMENT 2218 BATH, protect the bath from drag-in of contaminants, and can be used in both vertical and horizontal processing.

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CIRCUPOSIT™ ETCH 3330 is a mildly acidic micro-etch that promotes excellent copper innerlayer adhesion, and creates baths that are stable and active for very long periods of time with consistent etch rates.

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RONACLEAN™ EVP-210S Cleaner is a low-foaming acid cleaner designed for use in spray chemical cleaning processes.

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Inner Layer Bonding

Inner Layer Bonding

Alternative Oxide

Black Oxide

A-Gas Electronic Materials