Photo-dielectric Materials

  • EP3912/EP2793 Combination Passivation & Plate Resist

  • LSF60 WLP Photodielectric & Soldermask

    LSF60 is a liquid, photoimageable two component soldermask designed for use on high definition CSP/WLP Packages. LSF60 has a long track record of use in WLP applications where final components must pass stringent High Temperature Storage (2000 hours at 150°C), Thermal Cycling (1000 cycles -40°C to 125°C) and Moisture Sensitivity (2000 hours 85°C/85% RH) tests. Versions are available for application by screen printing and spin-coat. Excellent resolution and side-wall profile control. Compatible with lead-free processing. Suitable for electrolytic/electroless gold plating. Thermal cycling & crack resistance. Suitable for high temperature storage. 12 month shelf-life. Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.

  • WLP4478

    Electra WLP 4478 is a liquid, i-line photodielectric designed for wafer-level packaging applications. The product may be spin-coated onto glass and silicon wafers at thicknesses ranging from 5 - 40um. Electra WLP 4478 performance properties include: - Fast exposing - less than 250mJ/cm2 for sub-10um layers - Resolution capability to 15 um track and gap - Optimum properties achieved by 150oC cure - Processed by aqueous chemistry - Low Odour - Ambient storage, 12 month shelf life

  • WLP-SH32-1-1

    Electra WLP SH32-1-1 is a liquid, i-line photodielectric designed for wafer-level packaging applications. The product may be spin-coated onto glass and silicon wafers at thicknesses ranging from 5 - 40um. Electra WLP SH32-1-1 performance properties include: - Fast exposing - less than 250mJ/cm2 for sub-10um layers - Resolution capability to 15 um track and gap - Optimum properties achieved by 150oC cure - Processed by aqueous chemistry - Low Odour - Ambient storage, 12 month shelf life