Perminex

Material Attributes:
  • Negative tone, photo-imageable adhesives
  • Alkaline and solvent developable series
  • High resolution patterning
  • Low temperature processing (< 200°C)
  • High quality, void-free bonding
  • Superb adhesion to Silicon and Glass
  • Good process compatibility (dicing, soldering) and high reliability (HAST, TCT)



Resolution Capability


5µm features in 15µm thick PermiNex™ 1000
Source: MicroChem



Bonding Capability


Test cavity structures
 
Adhesive cavity wall

• High seal integrity after bonding
• High edge acuity
• No cracking or defects at corners
• Void free, conformal interface

Si to Glass bonded wafers, 10µm thick PermiNex™ adhesive structure
Source: MicroChem

 

 

  Overall Process Flow

Photolithography / Wafer Bonding

  • PermiNex 1000

    Microchem PermiNex 1000 is an epoxy based, photoimageable bonding resist used as a adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices and others, where critical alignment, low temperature processing  and high bond quality are required. PermiNex 1000 is available in four standard viscosities allowing for thicknesses of 1 to >25 micron to be achieved in a single coat.

  • PermiNex 2000

    Microchem PermiNex 2000 is an epoxy based, photoimageable bonding resist used as a adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices and others, where critical alignment, low temperature processing  and high bond quality are required. PermiNex 2000 is available in four standard viscosities allowing for thicknesses of 1 to >25 micron to be achieved in a single coat and is developed in a conventional alkaline developer (TMAH).