Chemically amplified Epoxy-based Negative Photoresist capable of 1-40µm in a single-spin @
3000rpm

Material Attributes:
i-line processing
High aspect ratio with vertical sidewalls
Good adhesion to most substrates
Alkaline developer compatible
(TMAH and KOH)
Strippable with wet or dry chemistry
Excellent dry etch resistance

Applications:
Electroplating
DRIE mask
MEMS