KMSF® 1000 & 2000

KMSF® 1000 is a negative tone, polyimide-based photo-dielectric for use as an ultra-low
stress buffer, passivation or protective layer.

KMSF® 2000 is a negative-tone, low-temperature cure, PPE-copolymer-based photo-dielectric for
high reliability heterogeneous design in advanced packaging.

  • KMSF® 1000

    Low Stress Dielectric Photoresist capable of 3-10µm in a single spin

    Material Attributes:
    No warpage due to low shrinkage and
    tensile modulus
    Solvent developable
    i-Line/broadband sensitivity, 1:1 aspect
    ratio imaging
    Low temperature processing (< 200°C)
    Good electrical properties
    High thermal and chemical stability
    Low moisture uptake


    Applications:
    Stress buffer
    Passivation and protective layers

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  • KMSF 2000

    KMSF® 2000 is a negative-tone, low-temperature cure, PPE-copolymer-based photo-dielectric for
    high reliability heterogeneous design in advanced packaging. It provides a unique advantage offering through its improved pattern resolution, low temperature cure, and robust balance of mechanical and electrical properties. It is designed for an optimal cured film thickness of 5 to 10 μm.

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