KMSF® 1000 & 2000
KMSF® 1000 is a negative tone, polyimide-based photo-dielectric for use as an ultra-low
stress buffer, passivation or protective layer.
KMSF® 2000 is a negative-tone, low-temperature cure, PPE-copolymer-based photo-dielectric for
high reliability heterogeneous design in advanced packaging.
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KMSF® 1000
Low Stress Dielectric Photoresist capable of 3-10µm in a single spin
Material Attributes:
No warpage due to low shrinkage and
tensile modulus
Solvent developable
i-Line/broadband sensitivity, 1:1 aspect
ratio imaging
Low temperature processing (< 200°C)
Good electrical properties
High thermal and chemical stability
Low moisture uptake
Applications:
Stress buffer
Passivation and protective layers -
KMSF 2000
KMSF® 2000 is a negative-tone, low-temperature cure, PPE-copolymer-based photo-dielectric for
high reliability heterogeneous design in advanced packaging. It provides a unique advantage offering through its improved pattern resolution, low temperature cure, and robust balance of mechanical and electrical properties. It is designed for an optimal cured film thickness of 5 to 10 μm.