Photoimageable Wafer Bonding Adhesives for Permanent and Non-hermetic Applications

Material Attributes:
i-line imaging, up to 3:1 aspect ratio
Alkaline and solvent developable series
Low temperature processing (< 200⁰C)
High quality, void-free bonding
Excellent adhesion to silicon and glass

Applications:
Definition and capping of cavity structures
BAW and SAW devices
MEMS, MOEMS, microfluidics