PermiNex® 1000 & 2000
Photoimageable Wafer Bonding Adhesives for Permanent and Non-hermetic Applications
Material Attributes:
i-line imaging, up to 3:1 aspect ratio
Alkaline and solvent developable series
Low temperature processing (< 200⁰C)
High quality, void-free bonding
Excellent adhesion to silicon and glass
Applications:
Definition and capping of cavity structures
BAW and SAW devices
MEMS, MOEMS, microfluidics