Microposit EC solvent 11 is engineered to eliminate the photoresist edge bead that occurs during typical spin coat wafer processing.

Removing the edge bead immediately after photoresist coating reduces the particulate associated defects caused by subsequent wafer processing.

Microposit EC Solvent 11 can also be used to clean and purge photoresist dispense lines and spinner cup bowls.

Microposit EC Solvent is part of the Microposit Positive Photoresist System and is optimised to satisfy industry requirements in advanced IC device fabrication. It offers significantly reduced health risk over commonly used resist solvent systems.

Methyl ethyl ketone (MEK) is a strong solvent that is typically used as a negative photoresist remover.

EBR PG is specifically formulated to quickly and cleanly remove edge beads that build-up during the spin coat process. Edge bead removal is performed immediately after spin coat by directing a stream of EBR PG near the edge of the wafer while it is spinning. The edge bead remover nozzle can be positioned near the wafer’s edge to dispense EBR PG from the top or from the backside/bottom. By controlling spin speed, nozzle position, and nozzle direction, the resist edge bead is removed. It is important during edge bead removal that the backside of the wafer/substrate not be contaminated with resist from the front. By choosing a spin speed appropriate for the size of the wafer, the resulting centrifugal force prevents this problem.

Acetone can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover.

Acetone can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover.