Copper Gleam BL
The Copper Gleam BL process produces deposits with the following characteristics: 1. High degree of levelling (dependent from agitation) 2. Brilliant brightness 3. Good throwing power 4. High ductility 5. Deposits may be over plated 6. Does not contain alcohol 7. Does not contain pigments 8. In normal cases only 2 additives are required Due to the high degree of levelling and brightness of the deposit the plating time is reduced considerably resulting in economic advantages such as lower additive consumption and reduced energy costs.
Copper Gleam CLX
Copper Gleam CLX is designed for use in the bright acid copper plating of printed circuit boards.
Copper Gleam DL 900
The dye containing decorative copper plating process, Copper Gleam DL 900 acid copper is mainly designed for rack plating applications to obtain mirror bright and highly levelled copper deposits.
Copper Gleam RG10 HS
Copper Gleam RG 10 is a copper electrolyte based on Methane Sulfonic Acid which produced semi-bright deposit. Copper Gleam RG 10 is especially suitable for reel-to-reel application. High applicable current density and good bath stability in high temperature range distinguish this process.
Copper Gleam XL 180.pdf
Copper Gleam XL 180 is a bright acid copper plating process. It is capable of producing bright, ductile copper deposits with a high degree of leveling.
Copper Glo 23
The Copper Glo 23 process produces bright, ductile copper deposits. Copper Glo 23 may be operated in conjunction with potassium as well as with sodium salts. The deposits produced are fully active so that further plating is possible without electro cleaning.
Copper Glo 38
The Copper Glo 38 process produces very bright, ductile copper deposits. Copper Glo 38 may be operated in conjunction with potassium as well as with sodium salts. The deposits produced are fully active so that further plating is possible without intermediate electro cleaning. Copper Glo 38 offers a wide applicable current density range up to 8 A/dm2.
Alkaline Cyanide Free
Rohm and Haas’s Cupron Strike is a patent-pending alkaline cyanide-free copper alloy plating process specifically developed for plating zinc-based die castings. The Cupron Strike is followed by Rohm and Haas’s Cupure copper plating process which makes for a completely cyanide-free system for plating zinc die castings and aluminium based alloys. Because the Cupron Strike does not behave like a cyanide strike in reference to its cleaning properties, special cleaners and activators have been developed to prepare the base metal for plating. The adherence of the Cupron Strike deposit, once the base metal has been treated with these pre-plate processes, is equal to or superior to that of cyanide copper strike deposits. In addition, the process allows for a simple, effective and inexpensive treatment of the effluent.
CuPure is a non-cyanide alkaline copper plating process that is easy to maintain and provides semi-bright ductile deposits with good throwing power. It is particularly suited on steel as a stopoff for carburising or nitriding and as a pre-plate for nickel, acid copper or other finishes. Waste disposal is simple and merely requires lime treatment of CuPure rinses to remove copper metal and harmful materials.