Circuposit Etch 3330
CIRCUPOSIT™ ETCH 3330 is a mildly acidic micro-etch that promotes excellent copper innerlayer adhesion, and creates baths that are stable and active for very long periods of time with consistent etch rates.
Super Strip 100 is a high speed immersion stripper for removal of gold and gold alloys from all basis metals. The room temperature solution has negligible attack on iron, nickel and alloys of these metals. For silver, copper and copper alloy substrates strict control is necessary to minimise attack (see Attack Rates), in case of no Super Strip Inhibitor is contained in Make up.
Super Strip 108 is a thallium free, high speed, immersion stripper for removal of gold and gold alloys from most basis metals. The process is specifically designed for back-stripping of gold flash deposits in selective plating equipment. Super Strip 108 operates at room temperature and the process performance can be adjusted to suit product and machine requirements. After backstripping any remaining thicker gold deposits are not discoloured and there is negligible attack on nickel substrates. Super Strip 108 can also be used for reclaim or rework applications in rack or barrel plating installations. Super Strip 108 is supplied as a liquid concentrate to which potassium cyanide is added.
Nickelstrip is a versatile nickel stripper that removes both, electrolytically and electroless deposited nickel from steel and copper alloys by simple immersion without attacking the base metal. Advantages of Nickelstrip: - non cyanide - suitable for steel and copper alloys - suitable for electroless and electrolytical deposited nickel and copper alloys - works also for aged electroless nickel deposits
Ronastrip TL-85 is designed for fast stripping of thin or tin-lead from copper and its alloys. It can be used in both dip and spray applications. Stripping rates of ca. 10 microns/minute can be achieved in still vat conditions, this can be increased to a maximum 50 microns/minute in spray conditions dependent upon agitation rate and temperature. Attack on copper is minimal (ca. 0.05 micron/minute), the copper being left in excellent condition for subsequent processing. The solution will dissolve about 100 g/l total tin and lead before it is exhausted. Ronastrip TL-85 is ideally suited for use on printed circuit boards e.g. edge tab stripping prior to gold plating especially in high speed linear tab plating machines, or metallic etch resist (tin or tin-lead) stripping to produce solder mask over bare copper boards.
Solderstrip EBS 2000
Solder Strip EBS-2000 is an anodic, non halide containing, electrolytic stripping process for fast removal of tin or tin-lead from stainless steel. This process is specifically designed for use in magazine-to-magazine platers where removal of tin-lead on stainless steel belt is necessary.
Solder Strip SM is a non-peroxide, non-fluoride containing process designed for fast stripping of tin or tin-lead from copper and its alloys. Solder Strip SM is primarily designed for use under spray agitation conditions but it can also be used in dip applications. Stripping rates of approx. 7 microns/minute can be achieved, which can be increased to a maximum 20 microns/minute under vigorous spray conditions dependent upon agitation rate and temperature. Solder Strip SM does not attack copper. Solder Strip SM does not leave any residues or “white smut“ nor do tin or lead salts precipitate from aged solutions on standing. The solution will dissolve about 100 g/l total tin and lead before it is exhausted when it should be replaced, although a replenishment system based on a 30% bail-out and replacement with new is feasible. Solder Strip SM is ideally suited for use on printed circuit boards e.g. edge-tab stripping prior to gold plating especially in high speed linear tab-plating machines. It can also be used to strip tin or tin-lead which has been applied as an etch resist in the production of soldermask over bare copper (SMOBC) boards. Solder Strip SM is suitable for use in equipment where the solution is in contact with titanium.