High Speed

  • Solderon BT-150

    Solderon BT-150 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines and provides fully bright pure tin deposits over a wide range of current density and bath temperature. The low-foaming Solderon BT-150 electrolyte is free of volatile aldehydes and may be operated at temperatures up to 45°C and tin concentrations up to at least 100 g/l without loss of deposit brightness. Convenient methods of analysis are available for the proprietary components.

  • Solderon BT-280

    Solderon BT-280 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. The Solderon BT-280 electrolyte gives bright deposit over a wide range of current density. Its propriety formulation controls both grain size and grain orientation, which results in a stable deposit. The additive system also plates bright Sn finish with minimum organic inclusions. Simple analytical procedures are available for all products in the process.

  • Solderon BHT-350

    Solderon BHT-350 Bright Tin is high speed, sulphonate-based tin electroplating product formulated for continuous electroplating of wire and connector strip in reel-to-reel machines. The Solderon BHT-350 Bright Tin electrolyte is free of volatile aldehydes and may be operated at temperatures up to 50°C.

  • Solderon MHS-W

    Solderon MHS-W is a high speed, non-foaming electroplating process for the rapid deposition of fine grain, matte tin and tin-lead alloy coatings from an organic sulfonate electrolyte. The process is particularly designed for use in wire plating equipment where foaming of the electrolyte is undesirable and can cause severe handling problems. The Solderon MHS-W system is based on a grain refining agent which does not produce a stable foam in the electrolyte, even under extreme agitation conditions. The components of the Solderon MHS-W are stable and soluble in the electrolyte at elevated temperatures which allows the use of higher cathodic current densities of operation. Uniform pure tin and tin-lead alloy deposits, which exhibit excellent solderability and fusing characteristics, are obtainable over a wide current density range.

  • Solderon ST-200

    Solderon ST-200 is a low foaming, organic sulfonate electroplating process for the high and low speed deposition of uniform, large well-polygonized grain tin deposits. Solderon ST-200 is specifically designed for use in high-speed magazine-to-magazine and reel-toreel electroplating equipment, where the process versatility is particularly well suited for semiconductor lead frame and electronic connector applications. The process can also be operated at modified parameters to meet the needs of low speed plating applications.

  • Solderon ST-300

    Solderon ST-300 is a high speed, sulphonate - based tin process formulated for continuous electroplating of lead frames in reel-to-reel and magazine-to-magazine machines. Due to its specific designed chemistry, the Solderon ST-300 electrolyte provides a deposit with a low whisker propensity. The tin deposits are matte to satin-bright in appearance and uniform over a wide range of current density. Simple neutralisation of drag-out rinse water will produce a non-hazardous effluent.

  • Solderon ST-300T
  • Solderon ST-380

    Solderon ST-380 is a high speed, sulphonate-based tin process formulated for continuous electroplating of lead frames in reel-to-reel and magazine-to-magazine machines over a wide current density range. Due to the specific chemistry design, the Solderon ST-380 electrolyte provides a deposit with low whisker propensity and excellent solderability performance especially at 215°C after 8 hours steam aging. Simple neutralization of drag-out rinse water will produce a non-hazardous effluent.

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Low Speed

  • Ronastan EC-1

    RONASTAN™ EC-1 is an acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range, and the deposits can be used as an etch resist in the manufacturing of printed circuit boards.

  • Solderon BT-250

    Solderon BT-250 is a sulphonate-based tin process designed to for rack or barrel plating of connectors and related components. Deposits are uniformly bright over a wide range of current density and exhibit good solderability characteristics. Simple neutralisation of dragout rinse water produces a non-hazardous effluent.

  • Solderon BT-280

    Solderon BT-280 (LS) is a sulphonate-based tin process designed for rack, barrel and vibration equipment plating of connectors and related components. Deposits are uniformly bright over a wide range of current density and exhibit good solderability characteristics. Simple analytical procedures are available for all products in the process. Simple neutralisation of dragout rinse water produces a non-hazardous effluent.

  • Solderon BHT-350
  • Solderon LG

    Solderon LG is a fluoroborate-free plating solution designed to deposit matte pure tin or tin-lead coatings onto the terminals of electronic components containing pH sensitive dielectric materials. The Solderon LG solution operates in the pH range 2.5 - 4.5 with minimal attack on glass/ceramic insulators which prevents subsequent deposition of metal onto the dielectric part of the components. Solderon LG can be used to process ceramic-based components such as chip capacitors and diodes or soft leaded-glass components e. g. ceramic dual-in-line packages (cerdips). The electrolyte can be used in either rack or barrel applications to produce deposits which meet the requirements of MIL STD 202 F.

  • Solderon LG M1

    SOLDERON™ LG-M1 is a fluoborate-free plating solution for depositing matte pure tin coatings onto the terminals of electronic components containing pH sensitive dielectric materials

  • Solderon MLS-100

    SOLDERON™ MLS-100 is a low-speed, sulphonate-based pure matte tin process formulated for rack or barrel plating.

  • Solderon SG-J

    SOLDERON™ SG-J is an organic sulfonate electroplating process specifically formulated for the electrodeposition of tin and tin-lead alloy coatings on pH-sensitive electronic components in either rack or barrel electroplating techniques.

  • Solderon ST-200

    Solderon ST-200 is a low foaming, organic sulfonate electroplating process for the high and low speed deposition of uniform, large well-polygonized grain tin deposits. Solderon ST-200 is specifically designed for use in high-speed magazine-to-magazine and reel-toreel electroplating equipment, where the process versatility is particularly well suited for semiconductor lead frame and electronic connector applications. The process can also be operated at modified parameters to meet the needs of low speed plating applications.

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