Gold/Cobalt Alloys

  • Auronal MRC

    Auronal MRC is versatile high efficiency cobalt alloyed gold process suitable for: a) Rack plating (e.g. printed circuit board) b) Barrel plating (e.g. female connectors) c) Controlled depth selective plating d) High speed jet selective plating The solution can be used for these requirements by modifying: – Gold concentration – Temperature – Current density – Cobalt Concentration Deposits show excellent wear resistance with freedom from porosity and meet US Specification ASTM B 488, Types I and II, Grade C.

  • Ronovel CM
  • Ronovel CM 388

    Ronovel CM-388 is a mildly acidic gold/cobalt plating process (US ASTM Spec. B 488, Type II, Grade C) for rack and barrel applications and is intended primarily for electrical connectors requiring excellent throwing power and high uniformity. The gold/cobalt alloy deposit has a bright, rich yellow appearance and good corrosion resistance. The process is designed to be resistant against oxidation during electrolysis and allows a high loading per litre of working solution.

  • Ronovel CM 97

    RONOVEL™ CM-97 is a mildly acidic, cobalt-alloyed gold plating process designed to provide bright deposits free of burning at high current densities in electronic finishing applications.

  • Ronovel LB 300

    RONOVEL™ LB-300 Electrolytic Gold is a mildly acidic cobalt-alloyed gold plating product, particularly designed for connector applications, to reduce gold bleed and to reduce unnecessary gold usage in high-speed reel-to-reel connector plating application.

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Gold/Nickel Alloys

  • Auro Glo MN

    Mildly acidic Gold/Nickel plating process especially designed for use in Vibrobot or similar equipment, for plating of connectors and other components of high quality standard. The bath is easy to operate, has high tolerance towards impurities and exhibits outstanding throwing power as well as metal distribution. Deposits show excellent wear resistance with freedom from porosity. Solution operates with additives in salt form for pH control and solution gravity maintenance. Replenisher material is specially concentrated to take account of minimum solution evaporation during operation. Auro Glo MN meets Specification US Mil. G 45204 B, Type I and II, Grade B, C, D.

  • Auronal MRN

    Auronal MRN is versatile high efficiency nickel alloyed gold process suitable for: a) Rack plating (e.g. printed circuit board) b) Barrel plating (e.g. female connectors) c) Controlled depth selective plating d) High speed jet selective plating The solution can be used for these requirements by modifying: – Gold concentration – Temperature – Current density The bright deposits show excellent wear resistance with freedom from porosity and meet US specification ASTM B 488 Types I and II, Grade C.

  • Ronovel HTN

    Ronovel HTN is a mildly acidic nickel-alloyed gold plating process designed to provide increased solution current loading due to the high solution conductivity. The incorporation of Ronovel HTN Booster increases the maximum current density attainable before the onset of burning. Other important features, in addition to increased plating speed, are reduced porosity, improved wear resistance and increased throwing power. The Ronovel HTN process is particularly recommended for improved metal distribution under barrel plating conditions. Ronovel HTN produces deposits that satisfy the US specification ASTM B 488, Type II, Grades B & C

  • Ronovel N

    Ronovel N, a mildly acidic nickel-alloyed gold plating process, is based upon completely novel technology and represents a new era of acid hard gold in which the maximum current density applicable before the onset of burning is increased remarkably. In addition to increased plating speed other important features are reduced porosity, improved wear resistance and increased throwing power. The Ronovel N process is recommended for continuous selective plating of connector contacts and for processing all other types of electrical contacts including printed circuit board edge tabs. Excellent metal distribution is also achieved under barrel plating conditions. Ronovel N has the highest known attainable deposition rate for any commercially available acid hard gold electrolyte. The outstanding advantages of Ronovel N over standard electrolytes are increased deposition rate without the need to increase gold metal content and the option to maintain deposition rate at reduced gold concentration. A deposition rate of 18 μm/minute can be achieved from the electrolyte containing 12 g/l gold under high-speed jet agitation conditions, which compares with a maximum 12 μm/minute from the previous best available "high performance" process i.e. Auronal MRN, operating with the same gold concentration and agitation rate. Under normal vat plating conditions, when containing only 4 g/l gold, Ronovel N can give a deposition rate of 1 micron in 3 minutes. By comparison, standard electrolytes require a gold concentration of 8 g/l to achieve the same deposition rate under the same agitation conditions. Ronovel N produces deposits that satisfy the U.S. specification ASTM B 488 Type II Grades B & C

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Pure Golds

  • Aurall 292

    Approximately neutral ultra pure gold process (U.S. ASTM Spec. B 488 Type III, Grade A). Designed to reduce gold losses by its high throwing power and avoidance of bare spots when plating multi-lead semi-conductor headers and flat packs. “Fill” use is eliminated. Deposit purity maintained, even in presence of high iron, nickel, cobalt, copper or lead contamination. Suitable for rack and barrel operation.

  • Aurall 292 HS

    Aurall 292 HS is a neutral ultrapure gold process which meets the requirements of U.S. ASTM Spec. B 488 Type III, Grade A + B. The solution is designed for use in rack or high speed jetting applications, and due to the high throwing power, bare spots are eliminated when plating flat packs. Deposit purity is maintained even in the presence of high iron, nickel, cobalt or lead contamination of the electrolyte.

  • Aurall 292M

    The Rohm and Haas Aurall 292 M process produces semi-bright ultra pure, 24 Karat, ductile gold deposits. Aurall 292 M is primarily designed to plate electronic components in barrel or rack operations. The process provides the following operational and economic advantages: – Excellent thickness uniformity over complicated shapes, thereby reducing gold losses due to over plating – Excellent throwing power – Excellent resistance to metallic impurities – Excellent ability to wire bond and solder Aurall 292 M has the further advantage of eliminating bare spots which are the result of bipolar effects prevalent in certain semiconductor packages. Aurall 292 M meets the requirements of U.S. ASTM Spec. B 488, Type III, Grade A.

  • Aurall 735

    Aurall 735 is an approximate neutral arsenic free gold plating process designed to produce ultrapure ductile gold deposits that meet the requirements of ASTM Spec. B 488, Type III, Grade A. Aurall 735 is suitable for processing semiconductor components in rack or barrel applications.

  • Auro Dure Series

    Auro Dure is an approximately neutral gold plating process with exceptional throwing power. The pure gold (99.99 %) deposits are lustrous, pore free, compressively-stressed and capable of hardness modification between 100 and 250 VHN (Vickers hardness number). Auro Dure deposits meet the requirements of US ASTM Spec. B 488, Type III, Grades B, C & D dependent on deposit hardness requirements. Auro Dure solutions can be used in either vat or barrel mode and have very high resistance to metallic impurities. Auro Dure is designed for use in a wide range of electronics applications and is non-aggressive to all known printed circuit photoresists. Auro Dure is normally dispensed to provide differing hardness values, the suffix number signifying the VHN required. For Auro Dure deposits with ca. 100 VHN specify Auro Dure 100 Make-up Solution For Auro Dure deposits with ca. 150 VHN specify Auro Dure 150 Make-up Solution For Auro Dure deposits with ca. 200 VHN specify Auro Dure 200 Make-up Solution For Auro Dure deposits with ca. 250 VHN specify Auro Dure 250 Make-up Solution

  • Aurojet UHS 2

    Aurojet UHS-2 is a pure gold process for use on semi - conductor or other electronic devices. Deposits are of very high purity with good alloying and bonding characteristics. The solution is designed for use at high plating speeds in selective plating equipment that incorporates jet stream agitation. The Aurojet UHS-2 solution is non-aggressive to nickel-iron substrates and does not produce immersion gold deposits on nickel-iron; consequently these metals do not build up in the solution as impurities which could cause associated heat resistance problems. The solution can be used with either pulsed or direct current. Pulse deposits conform to the requirements of US Spec. ASTM B 488, Type III, Grade A.

  • Auronal BGA

    The Rohm and Haas Auronal BGA (SEA) is a multipurpose, ultra pure gold plating process. Auronal BGA (SEA) produces ductile deposits particularly suitable for die attach and wire bonding applications. Auronal BGA (SEA) is characterised by improved tolerance to metallic impurities and the ability to produce consistently low deposit hardness values. A slightly acidic solution (pH 6.2) helps to preserve dry film integrity.

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