High performance two-part liquid clarifier for the precipitation of suspended solids in Solderon plating solutions. Clarostan CT-10 may also be used for the clarification of other tin and tin-lead solutions based on sulphuric acid. With excellent clarifying ability, Clarostan CT-10 also delays the re-occurrence of turbidity after treatment.
Solderon SD Antifoam
Solderon SD Antifoam is a non-silicone material designed for use in Solderon processes to suppress the foam generated by solution agitation and aeration. Solderon SD Antifoam is surface active and should only be used in reservoir tanks and on solution surfaces that do not directly contact the components being processed. Solderon SD Antifoam may interfere with tin or tin-lead deposition if allowed to contact the surface of the parts during plating.
Solderon BHT-90 produces fully bright, solderable, 90/10 tin-lead alloy deposits from a low foaming electrolyte. The process is characterized by its high cathode efficiency and ability to produce fully bright deposits at elevated temperatures over a wide operating range.
Solderon BT-64 is a low foaming electroplating process for the high speed deposition of bright 60/40 tin-lead alloys from a non-fluoroborate electrolyte. The process is distinguished by its low foaming character, minimizing the problem of poor definition caused by stable cathodic foam in controlled depth selective electro-deposition. Solderon BT-64 is designed for use in the high speed reel to reel selective electroplating of connector components. Deposits produced have excellent solderability and pass the Military Specification 202F.
Solderon BTD is a non-foaming electroplating process for high speed deposition of bright to semi-bright tin and tin/lead alloys from a non-fluoborate electrolyte. The process is distinguished by its high cathode efficiency and non-foaming character, which minimizes the problem of poor definition caused by stable cathodic foam in controlled depth cell electro deposition. Solderon BTD is designed for use in high speed reel-to-reel selective electroplating of connector components. The 90/10 tin-lead alloy system offers the most versatility with respect to the influence of cell design on bright tin-lead alloy electro-deposition. Deposits produced from the Solderon BTD process exhibit exceptional solderability performance, and meet or exceed Military Specification 202F.
High Speed Matte Tin/Copper Alloy Electroplating Process Solderon MTC-200 is a low foaming, organic sulfonate electroplating process for the high speed deposition of uniform, fine grain, matte tin/copper alloy coatings. Solderon MTC-200 is specifically designed for use in high speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor lead frame and electronic connector application. Characteristics 1. Environmetally friendly, lead-free coating 2. Low foaming electrolyte 3. Uniform deposit appearance 4. Excellent solderability 5. Minimum whisker formation probability
Solderon BLS-2 is a fluoborate free tin-lead electroplating process formulated for rack or barrel applications. The deposits, which are uniform and brilliant, can have an alloy composition in the range 60:40 to 95:5 tin-lead, depending on the respective concentrations of tin and lead in the solution. The additive system meets the requirements of the Directive 2003/53/EC of the European Parliament on the restriction of dangerous substances such as nonylphenol and nonylphenol ethoxylate.
Solderon LG is a fluoroborate-free plating solution designed to deposit matte pure tin or tin-lead coatings onto the terminals of electronic components containing pH sensitive dielectric materials. The Solderon LG solution operates in the pH range 2.5 - 4.5 with minimal attack on glass/ceramic insulators which prevents subsequent deposition of metal onto the dielectric part of the components. Solderon LG can be used to process ceramic-based components such as chip capacitors and diodes or soft leaded-glass components e. g. ceramic dual-in-line packages (cerdips). The electrolyte can be used in either rack or barrel applications to produce deposits which meet the requirements of MIL STD 202 F.