KrF 248nm Photoresists

  • UV 135

    UV135 is an advanced gate resist for use across multiple pitches using a binary mask.

  • UV 210
  • UV 53G
  • UVIII
  • UV5
  • UV1116

    UV1116 is a High Temperature, Positive DUV Consolidation Photoresist suitable for Line/Space, Trench, and CH/Via applications. UV1116 gives excellent resolution across all FEOL & BEOL feature types resulting in large process windows..

  • UV60

    UV™60 is a positive DUV photoresist designed for consolidation of implant, metal contact hole, and via applications for 200 nm features.

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KrF 248nm Thick Applications

  • UV 26

    UV™26 is a positive DUV photoresist with low viscosity, developed for deep implant lithographic applications.

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Negative KrF 248nm Photoresists

  • UVN30

    UVN30 is a negative-tone photoresist for DUV, X-ray, and e-beam applications. This resist is targeted for fast throughput device production rules down to 150 nm. Nested lines/spaces, isolated lines, posts, and contacts can be resolved with wide process windows. Minimal PEB sensitivity, insensitivity to airborne contaminants, and superior metal etch resistance are only some of the properties UVN30 offers. Recommended substrates include polysilicon, 300Å capped SiON, and Rohm and Haas Electronic Materials’ organic anti-reflection coating. UVN30 has been optimized for 0.26N developers.

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