Hole Plug Materials

Electra hole-plug materials are formulated as a plugging resist for via-holes on printed circuit boards in conjunction with liquid photoimageable soldermasks. They are 100% or high solids materials and are available in thermal or UV cure versions.

EM70 85% Solids Thermal Cure Hole-Plug

High solids material with excellent thixotropic properties and latent epoxy curing technology allowing cure times as short as 10-15 minutes.

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  • EM70
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EM75 100% Solids Thermal Cure Hole-Plug

Solvent free thermal cure material which reduces the risk of out-gassing and shrinkage in the via-hole during curing.

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  • EM75
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EMV75 100% Solids UV Cure Hole-Plug

Solvent free material suitable for processing through double-sided UV curing machines allowing rapid processing without risk of out-gassing.

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  • EMV75
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