Hole Plug Materials
Electra hole-plug materials are formulated as a plugging resist for via-holes on printed circuit boards in conjunction with liquid photoimageable soldermasks. They are 100% or high solids materials and are available in thermal or UV cure versions.
EM70 85% Solids Thermal Cure Hole-Plug
High solids material with excellent thixotropic properties and latent epoxy curing technology allowing cure times as short as 10-15 minutes.
EM75 100% Solids Thermal Cure Hole-Plug
Solvent free thermal cure material which reduces the risk of out-gassing and shrinkage in the via-hole during curing.
EMV75 100% Solids UV Cure Hole-Plug
Solvent free material suitable for processing through double-sided UV curing machines allowing rapid processing without risk of out-gassing.