Photrak Liquid Photoimageable Etch Resists

Photrak™ is a new generation liquid Photoimageable etch resist that offers a low cost, high quality alternative to dry film. Photrak™ is ideal for today's high yield, low cost, fine line, multilayer PCBs.
Applied by screen print, curtain coat, electrostatic spray or air spray, but best by roller coating, Photrak™ can achieve a dry film thickness of 10µm (0.4 mil). The result is increased fine line capabilities, fast exposure, a wide processing window and excellent adhesion to copper surfaces. Because Photrak® increases developer and stripper solution bath life by 100%, fabricators use less chemical solutions and reduce the need to treat waste water.

  • Sub 25 µm (1 mil) resolution capability
  • Rapid tack-dry delivering hard scuff resistance surface
  • Stackable after tack-dry for over 72 hours
  • 50 to 100mJ exposure allowing and fast throughput
  • Excellent adhesion and conformance to copper coatings
  • Latent image after exposure
  • Versions available for acid and alkali etching systems

Photrak ETAP240 SP innerlay resist for acid and alkali etch

ETAP240 is a contact exposure, negative working photoimageable etch and plate resist, formulated for use as a cost effective alternative to dry film-resist in the manufacture of high density multi-layer printed circuit boards. It can be applied by screen-printing or air-spray and is suitable for use with alkali and acid etchant solutions and plating solutions. After etching or plating it is easily removed in a sodium hydroxide solution or proprietary resist strippers.

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  • Photrak ETAP240 SP
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Photrak ETP240 RC innerlay resist for high volume roller coat and dip coat

ETP240 RC is a contact exposure, negative working photoimageable acid etch-resist formulated to be applied by roller-coating in the production of volume, high-density innerlayers. Short drying times, low exposure energy requirement, high surface hardness and >72 hour stackability ensure ETP240 delivers high yield and throughput levels.

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  • ETP240
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