PMGI SF / LOR A / LOR B

Lift-off Resists
Metal Deposition Processing


Material Attributes:

  • Won't intermix when over-coated with most imaging resists
  • High thermal stability: Tg ~ 195oC
  • Single step development of bi-layer stack in TMAH or KOH developers
  • Removes quickly and cleanly in conventional resist strippers
  • Enables sub 0.25µm micron bi-layer resist imaging
  • Enables high yield, very thick (>3µm) metal lift-off processing


Applications:

  • Data strage
  • III-V Semiconductors
  • Optoelectronics

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  • PMGI/LOR
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