Epoxy Materials

Conductive epoxy and potting compounds offer a route for assembly and sealing connections with conductive and non-conductive capabilities, such as component or wire attachment, potting elector/mechanical assemblies and low temperature solders replacement. Using the innovative CC-Pak packaging route provides ease of use with a two part mixing process and minimum wastage.

You can only view the below documents if you are logged in, so login or register today.

  • EP-600

    Thixotropic properties and non-stringing characteristics of EP-600 make it an ideal material for high-speed, dot dispense processes where low temperature curing is required. Combined with its low viscosity, these properties allow dot dispense processes to run up to 70% faster.

    Exhibits excellent adhesion to most metal and plastic substrates, excellent temperature resistance, toughness, and allows for differences in coefficients of thermal expansion between two bonded substrates.

    Lateral component push-off testing on print-treated mylar substrates show that EP-600 has 30 to 40% greater bond strength than other conductive epoxy adhesives.

    Convenient mix ratios and packaging in pre-weighed amounts allow for ease of use in fast paced production environments. EP-600 is available in dual, pre-weighed and sealed plastic pouches called CC-Paks, or in separate bulk jars.

  • EP-799

    Excellent temperature resistance, toughness, and allows for differences in coefficients of thermal expansion between two bonded substrates

    Can be applied by syringe

    Convenient mix ratios and packaging in pre-weighed amounts allow for ease of use in fast paced production environments. EP-799 is also available in dual, pre-weighed and sealed plastic pouches.

    Applied Ink Solutions can modify the cure speed, working time, or rheology of EP-799 to make it more compatible with your unique manufacturing process.

You can only view the above documents if you are logged in.