Performance Products
CMC Materials Performance Products Group offers a broad range of products and services required to achieve specific application criteria in semiconductor manufacturing. The increasingly finer line geometries required of semiconductor fabs worldwide make the precision manufacturing and blending of custom performance process chemicals more critical than ever.
In order to meet these critical needs, CMC Materials offers:
- Temperature-controlled manufacturing, storage, transportation and delivery
- Premixed products manufactured to exacting specifications
- Statistical process control of assay
CMC Materials ensures the consistency of etchants and mixes through stringent mixing procedures, sampling protocol and control of trace metals.
The Performance Products Group will manufacture to your custom specifications or we can provide our own products recommended for such applications.
What sets CMC's Performance Products Group apart is quality. Each product is mixed in a cleanroom environment, filtered and particle counted, and packaged in containers specially designed and manufactured for us to preserve the integrity of the chemicals you purchase.
Aluminium Etchant
Aluminum Etch allows for the controlled removal of excess aluminum, leaving a well-defined pattern of aluminum wiring.
You can only view the below documents if you are logged in, so login or register today.
-
Aluminium Etchant - VLSI
Ammonium Fluoride 40%
Ammonium fluoride is a buffer used in buffered oxide etchants. It keeps the etch rate on silicon oxide constant, as well as prevents HF from penetrating photoresist.
You can only view the below documents if you are logged in, so login or register today.
-
Ammonium Fluoride 40% w/v - VLSI
Buffered Oxide Etch
Buffered Oxide Etch is used for semiconductor patterning in silicon dioxide and cleaning applications.
You can only view the below documents if you are logged in, so login or register today.
-
Contact Etch 10:1 - VLSI
-
Contact Etch 20:1 - VLSI
-
Lodyne Silicon Dioxide Etch 5:1 - VLSI
-
Lodyne Silicon Dioxide Etch 7:1 - VLSI
-
Lodyne Silicon Dioxide Etch 10:1 - VLSI
-
Lodyne Silicon Dioxide Etch 20:1 - VLSI
-
Lodyne Silicon Dioxide Etch 5:1 MH - VLSI
-
Silicon Dioxide Etch 7:1 - VLSI
-
Silicon Dioxide Etch 10:1 - ULSI
-
Silicon Dioxide Etch 10:1 - VLSI
Chrome Etch
Chrome Etch removes excess metallic chrome, leaving a well-defined chrome pattern on a glass mask.
You can only view the below documents if you are logged in, so login or register today.
-
Chrome Etchant - VLSI
Hydrogen Peroxide
Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.
You can only view the below documents if you are logged in, so login or register today.
-
Hydrogen Peroxide 31% - VLSI