Process to produce thin, 24-karat gold immersion deposits that are uniform, fine-grained, and of extremely low porosity onto nickel substrates

Process designed to autocatalytically deposit semi-bright nickel-phosphorous alloys, containing 8-10% phosphorous, onto catalyzed copper and aluminum surfaces on silicon wafers

NiPlate BP 5000 is a stable, self-adjusting pH electroless nickel plating bath. NiPlate BP 5000 is designed to pro- duce an ultra-bright, wear-resistant electroless nickel deposit with very high as-plated hardness for advanced packaging applications over autocatalytic surfaces (i.e., zincated aluminum and palladium immersed copper).

NiPlate BP 5000 produces a pore-free, non-staining deposit on properly prepared substrates.

NiPlate BP 5000 system is designed to provide the end user with a highly-productive general purpose electro- less nickel bath with unusually high hardness and wear resistance. Excellent bath stability increases productivity by minimizing non-productive tank stripping time. The self-adjusting pH feature both simplifies operation and makes the bath ideal for use with automatic controllers.

Electroless nickel system for advanced semiconductor packaging applications

Autocatalytic process for use in electroless palladium plating

Electrolytic gold process developed for applications that require pure, soft gold deposits for electronic applications

The INTERVIA™ Cu 8510 process is a high-speed, thick-plating copper electroplating bath for pattern plate and copper post/bump formation on both wafer and organic substrates

The InterVia Cu 8530 process provides excellent throwing power and deposition with superior elongation. The InterVia Cu 8530 process has excellent filling performance of MVH (micro via hole), and thus is suitable for copper plating on wafer level CSP.

The InterVia Cu 8530 deposit has excellent thermal shock resistance contributed to good elongation and low stress. InterVia Cu 8530 is a two-component additive that is very stable in acidic environments.

The INTERVIA™ Cu 8540 process is a high-speed, thick-plating copper electroplating bath for pattern plate and copper post/bump formation on both wafer and organic substrates.

InterVia ViaFill is a proprietary acid copper electrochemistry uniquely formulated for high-volume manufacturing and optimised for use in Semitool^® plating tools.

Nikal™ BP RTU electrolytic nickel produces matte to semi-bright, low-porosity nickel deposits for wafer plating. Nikal™ BP is characterized by its ability to produce ductile deposits, making it particularly well-suited for semiconductor wafer applications requiring low-stressed nickel, solderable finishes and UBM barrier layers. Nikal™ BP also produces a superior basis layer for over-plating with DuPont Electronic Materials’ Aurofab™ BP electrolytic Gold, Palladure™ BP electrolytic palladium, and Solderon™ tin or tin/lead processes on semi-conductor
components.

The SOLDERON™ BP process is a high-speed, tin-lead alloy electroplating process specifically formulated for metalizing IC wafers in advanced semiconductor packaging bump plating applications.

SOLDERON BP TS 6000 Tin/Silver bump plating bath is a newly redesigned formulation specifically for use in a semiconductor wafer plating process, producing reflowable SnAg solder bumps for flip-chip packaging and 2.5D/ 3D packaging applications. This next-
generation chemistry delivers industry-leading plating rates, enhanced plating performance, bath stability and ease-of-use and maximum process flexibility.

NANOPLATE™ 5200 is a proprietary acid copper electrochemistry uniquely formulated for high-volume manufacturing. This chemistry has been designed for the 32 and 28 nm technology nodes but can be easily be integrated for less aggressive technology nodes. The NANOPLATE™ 5200 system consists of associated products manufactured to strict industry specifications. The highly-purified copper electrolyte ensures reproducible results with respect to film deposit characteristics and functional properties.