Alumina Substrates

  • DurALclean

    DurAlClean Etch Cleaner bath is a specially formulated, acidic, light etch cleaner for aluminium and its alloys. In a single operation, DurAlClean Etch Cleaner bath will simultaneously degrease, etch and de-oxidise aluminium. DurAlClean Etch Cleaner bath can also be used in both spray and immersion applications.

  • Duraprep 520

    DURAPREP™ 520 ZINCATE is a “dilute” alkaline, non-cyanide zincate system for the treatment of all aluminum alloys prior to plating operations, particularly electroless nickel plating. The uniform thin–film zincate coating formed provides excellent adhesion of subsequent deposits.

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Copper Substrate

  • Actronal 660

    Actronal 660 is an acidic descaler designed for the removal of oxides and heat scale from copper and iron based alloys. For difficult-to-process copper lead-frame alloys such as 7025, it is possible to avoid smut formation during the activation stage by using a mixture of Actronal 660 Make Up Salt plus Ronasalt 369.

  • Circuposit Etch 3330

    CIRCUPOSIT™ ETCH 3330 is a mildly acidic micro-etch that promotes excellent copper innerlayer adhesion, and creates baths that are stable and active for very long periods of time with consistent etch rates.

  • Ronasalt 369

    RONASALT™ 369 is a balanced mixture of acid salts, activators, and surface active agents that is used to replace most of the commonly-used plating room acids.

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Ferrous Substrates

  • Activator 1424

    Activator 1424(ER) is a water – based acid solution that activates steel, Kovar and certain stainless steels prior to electroless or electrolytic plating. In addition, Activator 1424(ER) can be used to reactivate passive electroless nickel coatings for further electroless nickel plating.

  • Actronal 660

    Actronal 660 is an acidic descaler designed for the removal of oxides and heat scale from copper and iron based alloys. For difficult-to-process copper lead-frame alloys such as 7025, it is possible to avoid smut formation during the activation stage by using a mixture of Actronal 660 Make Up Salt plus Ronasalt 369.

  • Ronaclean DLF

    Ronaclean DLF is a high efficiency, heavy duty, low foaming, soak / electro-cleaner, conceived for primary cleaning of steel and copper substrates. The process is suitable for rack, barrel and high - speed applications.

  • Ronasalt 369

    RONASALT™ 369 is a balanced mixture of acid salts, activators, and surface active agents that is used to replace most of the commonly-used plating room acids.

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Nickel Substrates

  • Activator 1424

    Activator 1424(ER) is a water – based acid solution that activates steel, Kovar and certain stainless steels prior to electroless or electrolytic plating. In addition, Activator 1424(ER) can be used to reactivate passive electroless nickel coatings for further electroless nickel plating.

  • Ronaclean DLF

    Ronaclean DLF is a high efficiency, heavy duty, low foaming, soak / electro-cleaner, conceived for primary cleaning of steel and copper substrates. The process is suitable for rack, barrel and high - speed applications.

  • Ronasalt 369

    RONASALT™ 369 is a balanced mixture of acid salts, activators, and surface active agents that is used to replace most of the commonly-used plating room acids.

  • Ronatab Acid Activator PC-1

    As nickel and nickel-based alloy substrates are easily passivated, activation of these surfaces through the use of Ronatab Acid Activator PC-1 allows for the deposition of uniform, adherent coating in subsequent plating operations. Ronatab Acid Activator PC-1 is particularly recommended for use in electronics applications, where gold, palladium, or tin/tin-lead is typically deposited onto nickel plated components and printed circuits edge tabs.

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