Nikal PC-2 is an additive designed to reduce internal stress in deposits from Watts or sulphamate - nickel electrolytes and is therefore especially suitable for use when nickel plating electronic components including printed circuits and also in electroforming applications. Pitting is controlled by addition of wetting agents. The electrolyte may be used in barrel or rack applications. Nikal PC-2 deposits are particularly suitable as an underplate e.g. with subsequent gold plating.

Nikal PC-3 is a single additive designed to reduce internal stress in Watts or sulfamate nickel solutions. The deposits produced are bright and ductile with a slight tendency to levelling. The process can be used in rack, barrel and high speed applications for plating all types of electronic components e.g. printed circuit boards and connectors, and for electroforming. The deposits have excellent receptivity to overplating with gold etc.

Nikal PC-4 is a single additive designed to reduce stress in Watts or sulphamate nickel solutions. The deposits produced are bright and ductile with a tendency to positive levelling. This process can be used in rack, barrel and high speed applications for plating all types of electronic components e.g. printed circuit boards, connectors and electroforming. The deposits have excellent receptivity to overplating with gold etc.

The Nikal PC-5 Additive is designed to reduce internal stress in Watts or sulphamate nickel solutions. The process can be used for plating of electronic components, including printed circuits, and also for electroforming and for decorative applications. Pitting is controlled by use of wetting agents. The solutions are suitable for rack or barrel operation. The deposits have excellent receptivity to overplating with gold, bright nickel, etc.

Spectra TGB Barrel Application process produces deposits with the following characteristics: - Brilliant brightness - Extremely bright throwing power - Good ductility - High degree of levelling Due to the high degree of levelling and brightness, existing exposition times in the nickel electrolyte can be reduced considerably (only applicable if the specified coating thickness is still guaranteed). The resulting economic advantages are: lower nickel consumption, lower energy costs, higher installation capacity.

Nickel Gleam EP-M is a single additive process designed to produce nickel-phosphorus deposits from nickel sulphate based electrolytes. The composition of the deposit produced is dependent on additive content and current density. Nickel Gleam EP-M can be used for rack, barrel and high-speed applications. Nickel Gleam EP-M allows phosphorus concentrations in the deposit to reach 11 % P or more. For applications where maximum ductility plus corrosion resistance is required, a duplex coating of nickel (Nikal PC-3 or SC) and a thin layer of Nickel Gleam EP-M is recommended.

Nicostan 91 is a tin-nickel process, suitable for both rack and barrel applications. Advantages: 1. Nicostan 91 produces bright deposits. 2. Nicostan 91 contains ca. 67% tin in the deposit and has very good corrosion resistance. 3. Nicostan 91 produces a uniform deposit colour and brightness over a wide current density range (0.1 - 4.0 A/dm2).

Nikal PC-2 is an additive designed to reduce internal stress in deposits from Watts or sulphamate - nickel electrolytes and is therefore especially suitable for use when nickel plating electronic components including printed circuits and also in electroforming applications. Pitting is controlled by addition of wetting agents. The electrolyte may be used in barrel or rack applications. Nikal PC-2 deposits are particularly suitable as an underplate e.g. with subsequent gold plating.

Nikal PC-3 is a single additive designed to reduce internal stress in Watts or sulfamate nickel solutions. The deposits produced are bright and ductile with a slight tendency to levelling. The process can be used in rack, barrel and high speed applications for plating all types of electronic components e.g. printed circuit boards and connectors, and for electroforming. The deposits have excellent receptivity to overplating with gold etc.

Nikal PC-4 is a single additive designed to reduce stress in Watts or sulphamate nickel solutions. The deposits produced are bright and ductile with a tendency to positive levelling. This process can be used in rack, barrel and high speed applications for plating all types of electronic components e.g. printed circuit boards, connectors and electroforming. The deposits have excellent receptivity to overplating with gold etc.

The Nikal PC-5 Additive is designed to reduce internal stress in Watts or sulphamate nickel solutions. The process can be used for plating of electronic components, including printed circuits, and also for electroforming and for decorative applications. Pitting is controlled by use of wetting agents. The solutions are suitable for rack or barrel operation. The deposits have excellent receptivity to overplating with gold, bright nickel, etc.

Nikal SC produces matte to semi-bright, low porosity nickel deposits in high speed equipment such as reel-to-reel or cut strip plating machines. Nikal SC is characterised by its ability to produce highly ductile deposits, making it particularly suitable for semiconductor applications where components undergo trim and form operations. The use of a nickel activator after the Nikal SC process, such as Rohm and Haas Acid Activator PC-1, ensures that uniform, adherent deposits will be produced when over-plating with gold, palladium, or tin/tin-lead on semiconductor components. Characteristics 1. Ductile, low porosity electrodeposits 2. Effective barrier to base material diffusion 3. Excellent solderability when protected with appropriate top coating 4. Ease of solution maintenance.

Spectra Black facilitates the plating of dark, anthracite coloured nickel deposits. Spectra Black is suitable for rack and barrel applications. Spectra Black nickel deposits have good abrasion resistance and offers interesting decorative combinations with gold or bright chrome.

Nickel Gleam BR 220 is a bright nickel plating process. It was developed to meet the high performance requirements demanded by the bright nickel plater and may be used as the top layer of a duplex nickel system where maximum corrosion protection of the substrate is required.

NICKEL GLEAM™ SB 200 is a semi-bright nickel plating process developed to meet the undercoat requirements for a Duplex Nickel deposit, especially when used in the plating-on-plastics industry.

Nikal PC-2 is an additive designed to reduce internal stress in deposits from Watts or sulphamate - nickel electrolytes and is therefore especially suitable for use when nickel plating electronic components including printed circuits and also in electroforming applications. Pitting is controlled by addition of wetting agents. The electrolyte may be used in barrel or rack applications. Nikal PC-2 deposits are particularly suitable as an underplate e.g. with subsequent gold plating.

Nikal PC-3 is a single additive designed to reduce internal stress in Watts or sulfamate nickel solutions. The deposits produced are bright and ductile with a slight tendency to levelling. The process can be used in rack, barrel and high speed applications for plating all types of electronic components e.g. printed circuit boards and connectors, and for electroforming. The deposits have excellent receptivity to overplating with gold etc.

Nikal PC-4 is a single additive designed to reduce stress in Watts or sulphamate nickel solutions. The deposits produced are bright and ductile with a tendency to positive levelling. This process can be used in rack, barrel and high speed applications for plating all types of electronic components e.g. printed circuit boards, connectors and electroforming. The deposits have excellent receptivity to overplating with gold etc.

The Nikal PC-5 Additive is designed to reduce internal stress in Watts or sulphamate nickel solutions. The process can be used for plating of electronic components, including printed circuits, and also for electroforming and for decorative applications. Pitting is controlled by use of wetting agents. The solutions are suitable for rack or barrel operation. The deposits have excellent receptivity to overplating with gold, bright nickel, etc.

Spectra LBN99 bright nickel process produces deposits with the following characteristics: 1. High degree of levelling 2. Brilliant brightness 3. High ductility 4. Good chrome plating receptivity Due to the high degree of levelling and brightness, existing exposition times in the nickel electrolyte can be reduced considerably (only applicable if the specified coating thickness is still guaranteed). The resulting economic advantages are: lower nickel consumption, lower energy costs, higher installation capacity.