CUPROTEC 3 is a process designed to prevent the tarnishing of copper and copper based alloys by atmospheric corrosion.

Oxyban 60 Copper Anti-Tarnish is a concentrated acid solution designed to prevent oxidation of copper surfaces by reacting with the active copper surface to form an invisible film. OXYBAN 60 Copper Anti-Tarnish treatment promotes the adhesion of dry film photoresists to the copper and helps prevent resist breakdown in pattern plating.

PORE BLOCKER™ 100 CONCENTRATE is a water soluble pore-blocker process concentrate designed for the protection of gold, silver, or copper plated surfaces.

PORE BLOCKER™ 200 water soluble post treatment process is designated for the protection of a thin layer of gold against discolouration due to corrosion.

PORE BLOCKER™ 200 water soluble post treatment process is designated for the protection of a thin layer of gold against discolouration due to corrosion.

Watershed 18 – is a liquid rinse aid to promote faster drying and reduce staining and spotting. – is added to the penultimate rinse tank – has a particular affinity for metals providing mild corrosion protection. – contains no NPE’s (nonyl phenol ethoxalates) – has no adverse effect on solderability of pure tin deposits

NEUTRA RINSE™ 80 is a rinse for neutralizing acidic films remaining on tin and tin-lead plated parts, minimizing staining during storage and handling.

Neutra Rinse 98 is a neutraliser for use in the semiconductor industry, Neutra Rinse 98 will neutralise acid films left on components after plating and will improve the solderability and ageing of the deposits. It can also be used for rack and barrel applications.

NO TARN™ SN-2 is an immersion post-treatment process for packaging technologies that stabilizes the surface of electroplated tin deposits without introducing contaminants that may affect solderability.

Solderguard 100 Post treatment produces a thin protective layer on tin deposits from Solderon ST 200 Tin plating baths, as well as those from the ST 300, ST 380 and ST 300T products. It creates a hydrophobic surface that repels moisture, preventing corrosion and subsequent whisker formation after high humidity/high temperature storage.