Auronal MRC is versatile high efficiency cobalt alloyed gold process suitable for: a) Rack plating (e.g. printed circuit board) b) Barrel plating (e.g. female connectors) c) Controlled depth selective plating d) High speed jet selective plating The solution can be used for these requirements by modifying: – Gold concentration – Temperature – Current density – Cobalt Concentration Deposits show excellent wear resistance with freedom from porosity and meet US Specification ASTM B 488, Types I and II, Grade C.

Ronovel CM-388 is a mildly acidic gold/cobalt plating process (US ASTM Spec. B 488, Type II, Grade C) for rack and barrel applications and is intended primarily for electrical connectors requiring excellent throwing power and high uniformity. The gold/cobalt alloy deposit has a bright, rich yellow appearance and good corrosion resistance. The process is designed to be resistant against oxidation during electrolysis and allows a high loading per litre of working solution.

RONOVEL™ CM-97 is a mildly acidic, cobalt-alloyed gold plating process designed to provide bright deposits free of burning at high current densities in electronic finishing applications.

RONOVEL™ LB-300 Electrolytic Gold is a mildly acidic cobalt-alloyed gold plating product, particularly designed for connector applications, to reduce gold bleed and to reduce unnecessary gold usage in high-speed reel-to-reel connector plating application.

Mildly acidic Gold/Nickel plating process especially designed for use in Vibrobot or similar equipment, for plating of connectors and other components of high quality standard. The bath is easy to operate, has high tolerance towards impurities and exhibits outstanding throwing power as well as metal distribution. Deposits show excellent wear resistance with freedom from porosity. Solution operates with additives in salt form for pH control and solution gravity maintenance. Replenisher material is specially concentrated to take account of minimum solution evaporation during operation. Auro Glo MN meets Specification US Mil. G 45204 B, Type I and II, Grade B, C, D.

Auronal MRN is versatile high efficiency nickel alloyed gold process suitable for: a) Rack plating (e.g. printed circuit board) b) Barrel plating (e.g. female connectors) c) Controlled depth selective plating d) High speed jet selective plating The solution can be used for these requirements by modifying: – Gold concentration – Temperature – Current density The bright deposits show excellent wear resistance with freedom from porosity and meet US specification ASTM B 488 Types I and II, Grade C.

Ronovel HTN is a mildly acidic nickel-alloyed gold plating process designed to provide increased solution current loading due to the high solution conductivity. The incorporation of Ronovel HTN Booster increases the maximum current density attainable before the onset of burning. Other important features, in addition to increased plating speed, are reduced porosity, improved wear resistance and increased throwing power. The Ronovel HTN process is particularly recommended for improved metal distribution under barrel plating conditions. Ronovel HTN produces deposits that satisfy the US specification ASTM B 488, Type II, Grades B & C

Ronovel N, a mildly acidic nickel-alloyed gold plating process, is based upon completely novel technology and represents a new era of acid hard gold in which the maximum current density applicable before the onset of burning is increased remarkably. In addition to increased plating speed other important features are reduced porosity, improved wear resistance and increased throwing power. The Ronovel N process is recommended for continuous selective plating of connector contacts and for processing all other types of electrical contacts including printed circuit board edge tabs. Excellent metal distribution is also achieved under barrel plating conditions. Ronovel N has the highest known attainable deposition rate for any commercially available acid hard gold electrolyte. The outstanding advantages of Ronovel N over standard electrolytes are increased deposition rate without the need to increase gold metal content and the option to maintain deposition rate at reduced gold concentration. A deposition rate of 18 μm/minute can be achieved from the electrolyte containing 12 g/l gold under high-speed jet agitation conditions, which compares with a maximum 12 μm/minute from the previous best available "high performance" process i.e. Auronal MRN, operating with the same gold concentration and agitation rate. Under normal vat plating conditions, when containing only 4 g/l gold, Ronovel N can give a deposition rate of 1 micron in 3 minutes. By comparison, standard electrolytes require a gold concentration of 8 g/l to achieve the same deposition rate under the same agitation conditions. Ronovel N produces deposits that satisfy the U.S. specification ASTM B 488 Type II Grades B & C

The Rohm and Haas Auronal BGA (SEA) is a multipurpose, ultra pure gold plating process. Auronal BGA (SEA) produces ductile deposits particularly suitable for die attach and wire bonding applications. Auronal BGA (SEA) is characterised by improved tolerance to metallic impurities and the ability to produce consistently low deposit hardness values. A slightly acidic solution (pH 6.2) helps to preserve dry film integrity.