Circuposit Neutraliser 3314 effectively neutralises and removes manganate residues following desmear in alkaline permanganate

Circuposit Neutraliser 4190 effectively neutralises the manganate residues following desmear. A Glass etch may be used in conjunction with this step.

For use with electrolytic regeneration. Circuposit Promoter 3308 is a replenishable alkaline permanganate bath that effectively removes drill smear and debris while texturising remaining resin surfaces to ensure consistently supperior coverage, adhesion and solderability.

CIRCUPOSIT™ Promoter 3310/4140 is an alkaline permanganate solution which effectively removes resin smear from inner layer junctions, whilst
cleaning and texturing the hole wall to improve the adhesion of plated copper.

CIRCUPOSIT™ Hole Prep 4126 Sweller is a solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent CIRCUPOSIT Promotor stage. It is a unique process, which defines a new standard for via plating. CIRCUPOSIT Hole Prep 4126 Sweller has been formulated to be capable of processing both traditional FR-4 type laminates and more advanced high Tg materials.