Circuposit Neutraliser 3314 effectively neutralises and removes manganate residues following desmear in alkaline permanganate

Circuposit Neutraliser 4190 effectively neutralises the manganate residues following desmear. A Glass etch may be used in conjunction with this step.

For use with electrolytic regeneration. Circuposit Promoter 3308 is a replenishable alkaline permanganate bath that effectively removes drill smear and debris while texturising remaining resin surfaces to ensure consistently supperior coverage, adhesion and solderability.

CIRCUPOSIT™ Promoter 3310/4140 is an alkaline permanganate solution which effectively removes resin smear from inner layer junctions, whilst
cleaning and texturing the hole wall to improve the adhesion of plated copper.

Circuposit 3304 cleans, conditions and activates all hole-wall surfaces for treatment by Circuposit Promoter 3308 thus ensuring consistently superior coverage, adhesion and solderability

CIRCUPOSIT™ Hole Prep 4126 Sweller is a solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent CIRCUPOSIT Promotor stage. It is a unique process, which defines a new standard for via plating. CIRCUPOSIT Hole Prep 4126 Sweller has been formulated to be capable of processing both traditional FR-4 type laminates and more advanced high Tg materials.