CIRCUPOSIT™ CONDITIONER 3320A is a mildly acidic conditioner for all hole-wall surfaces that promotes the adsorption of a thin, uniform layer of catalyst for total electroless copper coverage.

CIRCUPOSIT™ CONDITIONER 3323 A is a conditioner that contains powerful catalyst promoters that ensure total copper coverage of all epoxy and glass fiber surfaces resulting in void-free electroless copper plated through holes.

CIRCUPOSIT™ CONDITIONER 3325 is a powerful catalyst promoter which ensures complete electroless copper coverage on a wide variety of substrates.

CIRCUPOSIT™ ETCH 3330 is a mildly acidic micro-etch that promotes excellent copper innerlayer adhesion, and creates baths that are stable and active for very long periods of time with consistent etch rates.

CIRCUPOSIT™ CATALYST 3344/4444 is a colloidal palladium-tin catalyst that ensures reliable, optimum coverage and adhesion of electroless copper.

CIRCUPOSIT™ PRE-DIP 3340/4400 protects the subsequent catalyst bath from harmful drag-in of rinse waters or process chemicals, while ensuring absolutely clean copper surfaces.

CIRCUPOSIT™ 3350-1 Electroless Copper is an integral part of the Circuposit PTH High-build Electroless Copper Process. This provides ease of process control operation; low cost and built-in process flexibility available to the marketplace.

CIRCUPOSIT™ 3350-1 Electroless Copper is an integral part of the Circuposit PTH Low-build Electroless Copper Process. This provides ease of process control operation; low cost and built-in process flexibility available to the marketplace.

CIRCUPOSIT 3350-1 Electroless Copper is an integral part of the CIRCUPOSIT 3000-1 PTH Process, Dow Electronic Materials’ unique, patented process that redefines the standard for through-hole plating. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space, increasing process speed, improving reliability and quality. CIRCUPOSIT 3350-1 Electroless Copper provides ease of process control, the highest degree of through-hole reliability, low cost and built-in process flexibility. CIRCUPOSIT 3350-1 Electroless Copper has a wide operating window and offers exceptional stability. In addition, the CIRCUPOSIT 3350-1 Electroless Copper bath is based upon EDTA as the chelate. This bath yields deposits that are smooth, bright pink, uniform in color and low stress. At a temperature of 46°C (115°F), CIRCUPOSIT 3350-1 Electroless Copper will deposit approximately 1.25 μm in 25 minutes.

CIRCUPOSIT™ LC-9100 Electroless Copper is an integral part of the CIRCUPOSIT PTH Low-build Electroless Copper Process, Dow Electronic Materials’ unique, patented process that defines a new standard for low-build through-hole plating. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality. CIRCUPOSIT LC-9100 Electroless Copper offers ease of process control operation; low cost and built- in process flexibility available to the marketplace. CIRCUPOSIT LC-9100 Electroless Copper has a wide operating window and offers exceptional stability. In addition, the CIRCUPOSIT LC-9100 Electroless Copper bath is based upon EDTA as the chelate. The bath yields deposits that are smooth, bright pink, uniform in color and low stress. At an operating temperature of 30-36 oC (86-97 oF), the CIRCUPOSIT LC-9100 Electroless Copper will deposit 0.25－0.50 um (10－20 millionths of an inch) in 15 minutes.