Conditioner

  • Circuposit Conditioner 3320A

    CIRCUPOSIT™ CONDITIONER 3320A is a mildly acidic conditioner for all hole-wall surfaces that promotes the adsorption of a thin, uniform layer of catalyst for total electroless copper coverage.

  • Circuposit Conditioner 3323A

    CIRCUPOSIT™ CONDITIONER 3323 A is a conditioner that contains powerful catalyst promoters that ensure total copper coverage of all epoxy and glass fiber surfaces resulting in void-free electroless copper plated through holes.

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Microetch

  • Circuposit Etch 3330 Datasheet.pdf

    CIRCUPOSIT™ ETCH 3330 is a mildly acidic micro-etch that promotes excellent copper innerlayer adhesion, and creates baths that are stable and active for very long periods of time with consistent etch rates.

  • Circuposit Etch 3336
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Catalyst

  • Circuposit Catalyst 3344

    CIRCUPOSIT™ CATALYST 3344/4444 is a colloidal palladium-tin catalyst that ensures reliable, optimum coverage and adhesion of electroless copper.

  • Circuposit Pre-dip 3340

    CIRCUPOSIT™ PRE-DIP 3340/4400 protects the subsequent catalyst bath from harmful drag-in of rinse waters or process chemicals, while ensuring absolutely clean copper surfaces.

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Electroless Copper

  • Circuposit 3350-1 Electroless Copper Datasheet.pdf

    CIRCUPOSITTM 3350-1 Electroless Copper is an integral part of the CIRCUPOSIT 3000-1
    PTH Process, DuPont ’ unique, patented process that redefines the standard for through-hole
    plating. This novel self-accelerating electroless copper eliminates the need for a
    separate accelerator step, saving space, increasing process speed, improving reliability
    and quality.
    CIRCUPOSIT 3350-1 Electroless Copper provides ease of process control, the highest
    degree of through-hole reliability, low cost and built-in process flexibility. CIRCUPOSIT
    3350-1 Electroless Copper has a wide operating window and offers exceptional stability.
    In addition, the CIRCUPOSIT 3350-1 Electroless Copper bath is based upon EDTA as the
    chelate.
    This bath yields deposits that are smooth, bright pink, uniform in colour and low stress. At a
    temperature of 46°C (115°F), CIRCUPOSIT 3350-1 Electroless Copper will deposit
    approximately 1.25 μm in 25 minutes.

  • Circuposit 3350-1 Electroless Copper Low Build - Datasheet.pdf

    CIRCUPOSIT™ 3350-1 Electroless Copper is an integral part of DuPont ’ unique,
    patented PTH process that redefines the standard for through-hole plating. This novel self-accelerating
    electroless copper eliminates the need for a separate accelerator step, saving
    space, increasing process speed, improving reliability and quality.
    CIRCUPOSIT 3350-1 Electroless Copper provides ease of process control, the highest
    degree of through-hole reliability, low cost and built-in process flexibility. CIRCUPOSIT
    3350-1 Electroless Copper has a wide operating window and offers exceptional stability.
    In addition, the CIRCUPOSIT 3350-1 Electroless Copper bath is based upon EDTA as the
    chelate.
    This bath yields deposits that are smooth, bright pink, uniform in colour and low stress. At a
    temperature of 28 - 40°C (82 -104°F), CIRCUPOSIT™ 3350-1 Electroless Copper will
    deposit approximately 0.32 μm in 10 minutes.

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