CIRCUPOSIT™ CONDITIONER 3320A is a mildly acidic conditioner for all hole-wall surfaces that promotes the adsorption of a thin, uniform layer of catalyst for total electroless copper coverage.

CIRCUPOSIT™ CONDITIONER 3323 A is a conditioner that contains powerful catalyst promoters that ensure total copper coverage of all epoxy and glass fiber surfaces resulting in void-free electroless copper plated through holes.

CIRCUPOSIT™ ETCH 3330 is a mildly acidic micro-etch that promotes excellent copper innerlayer adhesion, and creates baths that are stable and active for very long periods of time with consistent etch rates.

CIRCUPOSIT™ CATALYST 3344/4444 is a colloidal palladium-tin catalyst that ensures reliable, optimum coverage and adhesion of electroless copper.

CIRCUPOSIT™ PRE-DIP 3340/4400 protects the subsequent catalyst bath from harmful drag-in of rinse waters or process chemicals, while ensuring absolutely clean copper surfaces.

CIRCUPOSITTM 3350-1 Electroless Copper is an integral part of the CIRCUPOSIT 3000-1
PTH Process, DuPont ’ unique, patented process that redefines the standard for through-hole
plating. This novel self-accelerating electroless copper eliminates the need for a
separate accelerator step, saving space, increasing process speed, improving reliability
and quality.
CIRCUPOSIT 3350-1 Electroless Copper provides ease of process control, the highest
degree of through-hole reliability, low cost and built-in process flexibility. CIRCUPOSIT
3350-1 Electroless Copper has a wide operating window and offers exceptional stability.
In addition, the CIRCUPOSIT 3350-1 Electroless Copper bath is based upon EDTA as the
chelate.
This bath yields deposits that are smooth, bright pink, uniform in colour and low stress. At a
temperature of 46°C (115°F), CIRCUPOSIT 3350-1 Electroless Copper will deposit
approximately 1.25 μm in 25 minutes.

CIRCUPOSIT™ 3350-1 Electroless Copper is an integral part of DuPont ’ unique,
patented PTH process that redefines the standard for through-hole plating. This novel self-accelerating
electroless copper eliminates the need for a separate accelerator step, saving
space, increasing process speed, improving reliability and quality.
CIRCUPOSIT 3350-1 Electroless Copper provides ease of process control, the highest
degree of through-hole reliability, low cost and built-in process flexibility. CIRCUPOSIT
3350-1 Electroless Copper has a wide operating window and offers exceptional stability.
In addition, the CIRCUPOSIT 3350-1 Electroless Copper bath is based upon EDTA as the
chelate.
This bath yields deposits that are smooth, bright pink, uniform in colour and low stress. At a
temperature of 28 - 40°C (82 -104°F), CIRCUPOSIT™ 3350-1 Electroless Copper will
deposit approximately 0.32 μm in 10 minutes.