Megaposit SPR3000 Series Photoresist is a positive photoresist engineered for i-line, g-line and broadband applications with high throughput and excellent process latitudes. The resist is optimised to provide maximum performance with robust process latitudes over a wide range of exposure wavelengths. This versatility makes it ideally suited for a number of applications, especially mix and match lithography.

Megaposit SPR3600 i-line Series Photoresist is a positive photoresist designed for very high throughput process requirements while still delivering excellent lithographic performance coupled with a very good wet etch and thermal stability.

The Megaposit SPR3600 i-line Series Photoresist also processes multi-wavelength capabilities and is an ideal cross over photoresist allowing mix and match capability.

The Megaposit SPR3600 i-line Series Photoresist  shows good performance on line and space and contact hole applications, it also has a complimentary range of L and M dyed products which are ideal for reflective substrates. The dilutions available for SPR3600 allow it to cover resist thickness requirements from 1 micron up to 4 micron allowing a single resist family to meet all the process requirements

Megaposit SPR500A Series photoresist is a high performance production i-line system designed to meet the requirements of advanced device fabrication, such as those associated with 4-16 megabyte DRAM production

Microposit S1800 G2 Series Photoresists are positive photoresist systems engineered to satisfy the microelectronics industry's requirements for advanced IC device fabrication. The system has been engineered using a toxicologically safer alternative casting solvent to the ethylene glycol derived ether acetates. The dyed photoresist versions are recommended to minimize notching and maintain linewidth control when processing on highly reflective substrates

SPR350 is an advanced mid-critical photoresist designed to give high throughput. SPR350 is developed as a multi-wavelength, all purpose photoresist ideal for mix and match applications. The SPR350 product family can be used for Line/Space and Contact Hole applications on a variety of substrates, including Silicon, Silicon-Dioxide, Nitride (SiN),and reflective Polysilicon/Metal substrates. The SPR350 product family is PFOS free and is available in both dyed and un-dyed versions. It offers excellent resolution with very good feature profiles for Line/Space, Trench, and ContactHole applications. SPR350 also performs well with Dry Etch,Wet Etch, and Implant processes, and can be used as a consolidation photoresist.

SPR660 is an advanced i-Line photoresist designed for processing 0.350 micron features and larger. SPR660 performs in both line/space and contact hole applications and on a variety of substrates, including silicon, silicon dioxide, titanium nitride, and organic anti-reflectant coatings. The SPR660 product family includes a range of undyed dilutions as well as two dye loadings (low and medium) for improved processing over reflective surfaces

MEGAPOSIT™ SPR™955-CM Series Photoresist is a general purpose, high-throughput, i-Line photoresist for 0.35 µm frontend and backend applications.

Ultra-I 123 is an advanced, general purpose 250nm critical i-line photoresist with extendibility to 230nm and below

SPR220 i-Line photoresist is a general-purpose, multiwavelength resist designed to cover a wide range of film thicknesses, 1–30 μm, with a single-coat process. SPR220 also has excellent adhesion and plating characteristics, which make it ideal for such thick film applications as MEMs and bump processes.

MCPRis124MG is an advanced thick photoresist designed for processing Mid-Critical and BEOL features.MCPRis124MG offers very high throughput for mid-thick to thick applications. It performs well in Line/Space and Trench applications from 1um upto 50um feature sizes and works well on a variety of substrates, including Silicon, Silicon-Dioxide, Nitride (SiN), and reflective Polysilicon/Metalsubstrates. MCPRis124MG offers good resolution with very good feature profiles for Line/Space, & Trench applications, and achieves a very high aspect ratio. MCPRis124MG performs well with DryEtch, Wet Etch, and Implant processes, and can be used as a consolidation photoresist. The MCPRis124MG product family is also PFOS/PFOA free