Photrak™ is a new generation liquid Photoimageable etch resist that offers a low cost, high quality alternative to dry film. Photrak™ is ideal for today's high yield, low cost, fine line, multilayer PCBs.
Applied by screen print, curtain coat, electrostatic spray or air spray, but best by roller coating, Photrak™ can achieve a dry film thickness of 10µm (0.4 mil). The result is increased fine line capabilities, fast exposure, a wide processing window and excellent adhesion to copper surfaces. Because Photrak® increases developer and stripper solution bath life by 100%, fabricators use less chemical solutions and reduce the need to treat waste water.
- Sub 25 µm (1 mil) resolution capability
- Rapid tack-dry delivering hard scuff resistance surface
- Stackable after tack-dry for over 72 hours
- 50 to 100mJ exposure allowing and fast throughput
- Excellent adhesion and conformance to copper coatings
- Latent image after exposure
- Versions available for acid and alkali etching systems
ETAP240 is a contact exposure, negative working photoimageable etch and plate resist, formulated for use as a cost effective alternative to dry film-resist in the manufacture of high density multi-layer printed circuit boards. It can be applied by screen-printing or air-spray and is suitable for use with alkali and acid etchant solutions and plating solutions. After etching or plating it is easily removed in a sodium hydroxide solution or proprietary resist strippers.
Photrak ETAP240 SP
ETP240 RC is a contact exposure, negative working photoimageable acid etch-resist formulated to be applied by roller-coating in the production of volume, high-density innerlayers. Short drying times, low exposure energy requirement, high surface hardness and >72 hour stackability ensure ETP240 delivers high yield and throughput levels.