KMSF^® 1000 is a negative tone, polyimide-based photo-dielectric for use as an ultra-low stress buffer, passivation or protective layer.

Material Attributes:

• Negative tone, photoimageable dielectric
• No warpage due to low shrinkage and tensile modulus
• Solvent developable
• I-Line/broadband sensitivity, 1:1 aspect ratio imaging
• Low temperature processing (< 200°C)
• Good electrical properties
• high thermal and chemical stability
• Low moisture uptake

Applications:
• Stress buffer
• Passivation and protective layers

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KMSF® 2000 is a negative-tone, low-temperature cure, PPE-copolymer-based photo-dielectric for high-reliability heterogeneous design in advanced packaging. It provides a unique advantage offering through its improved pattern resolution, low-temperature cure, and robust balance of mechanical and electrical properties. It is designed for an optimal cured film thickness of 5 to 10 μm.

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