Nano Imprint Lithography

  • NIL_Flyer_2022_wickelfalzA4_NILDayFinale.pdf
  • mr-NIL210-series_PI_mr_NIL_210_2017_0.pdf

    mr-NIL210 is a purely organic, photo-curable NIL resist featuring excellent curing and nanoimprint performance in combination with PDMS soft stamp materials. The most important industrial key parameters are: optimised PDMS compatibility for extended stamp longevity, increased dry etching resistance, and excellent reproducibility enabling
    high volume production.

  • mr-NIL200-series_PI_mr_NIL_200_2019.pdf

    The mr-NIL200 series are photo-curable NIL resist formulations specifically developed for UV nanoimprint lithography
    (UV-NIL) applying gas-impermeable stamp materials. The typical application field of mr-NIL200 is the use as an etch mask in pattern transfer processes for e.g. photonic applications via reactive ion etching approaches. The mr-NIL200 series is available as ready-to-use formulations and works without the need for any additional adhesion promoter or primer

  • mr-UVCur26SF_PI_mrUVCur26SF_2017_0.pdf

    mr-XNIL26SF can be applied as a single-layer resist without any adhesion layer on a variety of substrates like Si, glass, plastics, metals, etc.
    The fluorinated components facilitate the demolding step and also increase the lifetime of anti-sticking layers

  • mr-NIL-6000E-seriesPI_mr_NIL_6000E_2017.pdf

    Thermoset Resist for Heat Assisted UV-Nanoimprint Lithography

  • pi_9000e_9000m_mri_en_08021202_ls.pdf

    Thermoset for pattern transfer

    Application by spin coating, film thickness 100 – 300 nm
    Short imprint cycle times
    Thermal curing during imprint
    Very low residual layer thickness down to 5 nm
    Excellent pattern transfer fidelity
    Residue-free removal by oxygen plasma etching

  • mr-I-7000R-Serie_PI_mr_I_7000R_8000R_2017_0.pdf

    mr-I 7000R and mr-I 8000R – Thermoplastics with Built-in Release Properties

  • SIPOL-series_PI_SIPOL_2015.pdf

    SIPOL is typically applied in a bilayer system, i.e. in combination with an underlying organic transfer layer like UL1 for example. This approach renders the fabrication of high aspect ratio patterns by an amplification of the imprinted relief of the SIPOL layer into the underlying organic transfer layer and in the substrate material by applying a sequence of consecutive plasma etch processes. In special cases or if required, SIPOL can also be applied as a single resist layer

  • mr-I-T85-series_PI_mr_I_T85_2017_0.pdf

    mr-I T85 – Polymer for lab-on-a-chip, optical and bio applications

    The mr-I T85 series has been developed preferably for permanent applications
    in lab-on-a-chip systems, microfluidics, and micro-optical components

  • MRT PMMA mr-I.pdf

    Excellent film quality
    • Attainable smallest feature size at least 50 nm
    (depending on stamp resolution)
    • Safe solvents
    • Low molecular weights (35k, 75k)

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