SU-8, SU-8 2000, SU-8 3000, SU-8 TF6000 & KMPR

KMPR

Chemically Amplified Epoxy-based Negative Photoresist capable of 1-100um in a single-spin @ 3000rpm
 

MicroChem epoxy resists consist of chemically amplified, epoxy-based negative resists that are highly functional, and photo-imageable to near UV (365nm) radiation. Cured films or microstructures are very resistant to solvents, acids and bases and have excellent thermal and mechanical stability, making them well suited for fabricating permanent structures such as pixel walls, fluidic channels and nozzles, micro arrays and spacers.


Material Attributes:

  • i-line processing
  • high aspect ratio with vertical sidewalls
  • Photo-definable ultra-thick structures
  • Outstanding thermal and chemical stability
  • Excellent etch resistance

 
Applications:

  • MEMS
  • DRIE etch mask
  • Microfluidics
  • Optoelectronics
  • Displays

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  • MCC-SU8 2-25

    SU-8 is a high contrast, epoxy-based photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired. The exposed and subsequently cross-linked portions of the film are rendered insoluble to liquid developers. SU-8 has very high optical transparency above 360nm, which makes it ideally suited for imaging near vertical sidewalls in very thick films. SU-8 is best suited for permanent applications where it is imaged, cured and left in place.

  • MCC SU8 50 - 100

    1st generation SU-8, thicker viscosity for thickness ranges 50-100um

  • MCC SU8 2000.5 - 2015

    SU-8 2000 chemically amplified, i-Line resists are well-suited for the fabrication of permanent device structures. These negative tone, epoxy based resists exhibit excellent chemical resistance and low Young's Modulus which makes them ideal for fabricating micro/nano structures such as cantilevers, membranes, and microchannels.

  • MCC SU8 2025 - 2075

    SU-8 2000 mid range of viscosities for 25-75um thicknesses

  • MCC SU8 2100 - 2150

    SU-8 2000 thicker range of viscosities for 100-150um thicknesses

  • SU8 3000

    SU-8 3000 has been formulated for improved adhesion and reduced coating stress. It is being used where high bond strength and improved flexibility for microstructure fabrication is desired. As a result, adhesion to the substrate is greatly improved.

  • MCC SU8 TF6000

    SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.

  • KMPR Data Sheet ver 4.1.pdf

    KMPR 1000 i-line photoresist is a high contrast, epoxy based photoresist that can be developed in conventional aqueous alkaline developer (TMAH) and readily stripped from the wafer.

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