Conductive epoxy and potting compounds offer a route for assembly and sealing connections with conductive and non-conductive capabilities, such as component or wire attachment, potting elector/mechanical assemblies and low temperature solders replacement. Using the innovative CC-Pak packaging route provides ease of use with a two part mixing process and minimum wastage.
PriElex EP-600 TDS Jan 26 2023 final.pdf
EP-600 two-part silver-filled conductive epoxy is designed for component attachment, termination and other applications in hybrid
circuits, membrane keypads and other electromechanical assemblies.
Excellent temperature resistance, toughness, and allows for differences in coefficients of thermal expansion between two bonded substrates
Can be applied by syringe
Convenient mix ratios and packaging in pre-weighed amounts allow for ease of use in fast paced production environments. EP-799 is also available in dual, pre-weighed and sealed plastic pouches.
Applied Ink Solutions can modify the cure speed, working time, or rheology of EP-799 to make it more compatible with your unique manufacturing process.