Epoxy Materials
Conductive epoxy and potting compounds offer a route for assembly and sealing connections with conductive and non-conductive capabilities, such as component or wire attachment, potting elector/mechanical assemblies and low temperature solders replacement. Using the innovative CC-Pak packaging route provides ease of use with a two part mixing process and minimum wastage.
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EP-600
Thixotropic properties and non-stringing characteristics of EP-600 make it an ideal material for high-speed, dot dispense processes where low temperature curing is required. Combined with its low viscosity, these properties allow dot dispense processes to run up to 70% faster.
Exhibits excellent adhesion to most metal and plastic substrates, excellent temperature resistance, toughness, and allows for differences in coefficients of thermal expansion between two bonded substrates.
Lateral component push-off testing on print-treated mylar substrates show that EP-600 has 30 to 40% greater bond strength than other conductive epoxy adhesives.
Convenient mix ratios and packaging in pre-weighed amounts allow for ease of use in fast paced production environments. EP-600 is available in dual, pre-weighed and sealed plastic pouches called CC-Paks, or in separate bulk jars.
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EP-799
Excellent temperature resistance, toughness, and allows for differences in coefficients of thermal expansion between two bonded substrates
Can be applied by syringe
Convenient mix ratios and packaging in pre-weighed amounts allow for ease of use in fast paced production environments. EP-799 is also available in dual, pre-weighed and sealed plastic pouches.
Applied Ink Solutions can modify the cure speed, working time, or rheology of EP-799 to make it more compatible with your unique manufacturing process.
