Silver Inks
A range of highly conductive silver inks which can be readily deposited via a number of deposition techniques as delivered or via a wider range of techniques when thinned. These ink materials can also be dried in heated or room temperature environments depending on production requirements.
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AG-500A
Proprietary copolymer system offers excellent adhesion, very good hard crease resistance and low point to point resistance
Ideal for long traces
Can be thinned with solvent for spraying or dipping for EMI/RFI shielding applications
Extremely tough, scuff resistant and crease resistant
Excellent adhesion to polyester, polyimide, ITO and most other substrates
Formulation balances longer open time on screens and short drying time in subsequent drying processes
Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
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AG-510
Silver filled, electrically conductive, screen printable ink or coating
Can be printed on ITO
Can be thinned with solvent for spraying or dipping for EMI/RFI shielding applications
Extremely tough, scuff resistant, crease resistant and has excellent adhesion to polyester, polyimide and most other substrates.
Designed to give a good balance between long open time on screens and short drying time in subsequent drying processes.
Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings.
Formulation of AG-510 balances longer open time with quicker drying
AG-510 can be blended with C-100 carbon resistive ink to give intermediate resistivity ranges.
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PriElex TDS AG-800 Silver Conductive Ink Oct 13, 2022 final.pdf
AG-800 Silver Conductive Ink is a silver-filled, electrically conductive ink for high-speed screen printing.
Features
• Formulated to provide fast drying at low temperatures, while maintaining long open times on screens
• Tough, scuff resistant
• Excellent adhesion to polyester, polyimide, and polycarbonate films and most metal surfaces
• Outstanding crease resistance
• Thin with solvent for spraying or dipping for EMI/RFI shielding applications
• Can be blended with carbon ink to obtain Intermediate resistance values
• Compatible with our UV-curable dielectrics, conductive epoxy adhesives and UV-curable component encapsulants.Applications
• Flex circuits
• Membrane switches
• EMI/RFI shielding
• Other printed electronic applications -
PriElex TDS AG-919 Heat Stable Silver Ink Oct 13 2022 Final.pdf
AG-919 Heat Stable Silver Ink is a silver-filled electrically conductive screen printable ink or coating designed to operate in higher temperatures.
Features
• Heat stable at 175oC to 200oC depending on time at temperature
• May be used as a seed layer for plating processes
• Thin with solvent for spraying or dipping for EMI/RFI shielding applications
• Tough and scuff resistant
• Excellent adhesion to most metal surfaces, polyester, polyimide, and polycarbonate films
• Outstanding crease resistance
• Compatible with our UV curable dielectrics, silver/silver chloride inks, conductive epoxy adhesives and UV curable component encapsulants.Applications
• Flex circuits
• Membrane switches
• EMI/RFI shielding
• Base layer for plating processes
• Other printed electronic applications -
AG-1074
Pad printable, silver filled, electrically conductive ink
Extremely tough, scuff resistant, crease resistant and has excellent adhesion to polyester, polyimide and most other polymer substrates as well as metal surfaces
Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
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Z-904
Z-904 UV Curable Anisotropic Ink conducts electricity on the Z-axis direction through the thickness, and not along width or length of the printed ink
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AG-515-1-Sept-30-2020-Ver-1.pdf
PRODUCT FEATURES
• Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
• Can be thinned with solvent for spraying, dipping or slot die coating or EMI/RFI shielding applications
• Long open time to reduce nozzle clogging
• Extremely tough, scuff resistant, crease resistant
• Excellent adhesion to polyester, polyimide and most other substrates
• Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants