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SOLDERON™ BT-280 is a high speed, sulphonate-based tin process formulated for continuous electroplating of wire and connector strip in reel-to-reel machines.

Material Features:

  • Its high deposition rates mean that it achieves high throughput values
  • Produces high level of brightness and excellent solderability
  • It is a low-foaming electrolyte
  • The deposits are low-carbon (less than 0.1%) Solderon BT-280 electrolyte offers bright deposit over a wide range of current densities
  • Its propriety formulation controls both grain size and grain orientation, resulting in a stable deposit
  • The additive system also plates bright SN finish with minimum organic inclusions
  • Simple analytical procedures are available for all products in the process
  • It achieves consistent and stable surface morphology
  • Partial plating and control depth plating are possible thanks to its white foam line