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Solderon BT-64

Solderon BT-64 is a low foaming electroplating process for the high speed deposition of bright 60/40 tin-lead alloys from a non-fluoroborate electrolyte.

The process is distinguished by its low foaming character, minimizing the problem of poor definition caused by stable cathodic foam in controlled depth selective electro-deposition.

Solderon BT-64 is designed for use in the high speed reel to reel selective electroplating of connector components. Deposits produced have excellent solderability and pass the Military Specification 202F.