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AUROLECTROLESS™ SMT 525G Immersion Gold

AUROLECTROLESSTM SMT 525G Immersion Gold bath produces uniform fine-grained deposits of pure gold on metallic substrates including electroless nickel and electroless palladium. Applied as part of ENIG or ENEPIG processes, the deposits are suitable for a wide variety of soldering and wire bonding applications.

Pack Sizes and Applications:

  • Soldering
  • Wire bonding

Material Features:

  • Easy to control and has a high tolerance to contaminants
  • Lower operating costs thanks to reduced gold content
  • It is free of chelates such as EDTA, making it an environmentally-friendly option
  • It offers excellent solderability

Manufacturer: